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Patent Assignment Assignor Details
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Assignor Name : LAM, KAI TAK
Total Assignments: 7
Assignment: 1
Reel/Frame:047759/0135   Pages: 5
Recorded: 12/12/2018
Attorney Dkt #:2018-1157/24061.3796US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors
1
LIN, CHENG-MING
Exec Dt:
11/22/2018
2
LAM, KAI TAK
Exec Dt:
11/22/2018
3
YEONG, SAI-HOOI
Exec Dt:
11/22/2018
4
CHUI, CHI ON
Exec Dt:
11/22/2018
5
FANG, ZIWEI
Exec Dt:
11/22/2018
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
10707320
US20200127111
16218151
Correspondence name and address
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219
Assignment: 2
Reel/Frame:054079/0446   Pages: 5
Recorded: 10/16/2020
Attorney Dkt #:2018-1157/24061.3796US02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors
1
LIN, CHENG-MING
Exec Dt:
11/22/2018
2
LAM, KAI TAK
Exec Dt:
11/22/2018
3
YEONG, SAI-HOOI
Exec Dt:
11/22/2018
4
CHUI, CHI ON
Exec Dt:
11/22/2018
5
FANG, ZIWEI
Exec Dt:
11/22/2018
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
11282940
US20200335599
16946736
Correspondence name and address
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
DALLAS, TX 75219
Assignment: 3
Reel/Frame:055843/0327   Pages: 5
Recorded: 04/06/2021
Attorney Dkt #:890102.559
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors
1
CHEN, TAI-YU
Exec Dt:
09/30/2020
2
KHIVSARA, SAGAR DEEPAK
Exec Dt:
09/30/2020
3
LIU, KUO-AN
Exec Dt:
09/30/2020
4
HSIEH, CHIEH
Exec Dt:
09/30/2020
5
CHIEN, SHANG-CHIEH
Exec Dt:
09/30/2020
6
CHANG, GWAN-SIN
Exec Dt:
09/30/2020
7
LAM, KAI TAK
Exec Dt:
09/30/2020
8
CHEN, LI-JUI
Exec Dt:
10/05/2020
9
LIU, HENG-HSIN
Exec Dt:
10/05/2020
10
WU, CHUNG-WEI
Exec Dt:
09/30/2020
11
WU, ZHIQIANG
Exec Dt:
09/30/2020
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
11392040
US20210349396
17193827
Correspondence name and address
SEED IP LAW GROUP LLP - DAVID CONLEE
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104
Assignment: 4
Reel/Frame:057410/0804   Pages: 5
Recorded: 09/08/2021
Attorney Dkt #:890102.588
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors
1
CHEN, TAI-YU
Exec Dt:
04/11/2021
2
LIN, CHO-YING
Exec Dt:
04/23/2021
3
KHIVSARA, SAGAR DEEPAK
Exec Dt:
04/08/2021
4
CHEN, HSIANG
Exec Dt:
04/16/2021
5
HSIEH, CHIEH
Exec Dt:
04/23/2021
6
YU, SHENG-KANG
Exec Dt:
04/08/2021
7
CHIEN, SHANG-CHIEH
Exec Dt:
04/14/2021
8
LAM, KAI TAK
Exec Dt:
04/08/2021
9
CHEN, LI-JUI
Exec Dt:
05/02/2021
10
LIU, HENG-HSIN
Exec Dt:
04/08/2021
11
WU, ZHIQIANG
Exec Dt:
04/08/2021
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
11647578
US20230065403
17462563
Correspondence name and address
SEED IP LAW GROUP LLP
701 5TH AVE
SUITE 5400
SEATTLE, WA 98104
Assignment: 5
Reel/Frame:058850/0527   Pages: 4
Recorded: 02/01/2022
Attorney Dkt #:2021-0909/24061.4527US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors
1
LIU, KUO-AN
Exec Dt:
01/03/2022
2
TU, WEN-CHIUNG
Exec Dt:
01/02/2022
3
HSIAO, YUAN-YANG
Exec Dt:
01/02/2022
4
LAM, KAI TAK
Exec Dt:
01/02/2022
5
HUANG, CHEN-CHIU
Exec Dt:
01/02/2022
6
WU, ZHIQIANG
Exec Dt:
01/02/2022
7
CHEN, DIAN-HAU
Exec Dt:
01/09/2022
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
NONE
US20230145953
17589500
Correspondence name and address
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219
Assignment: 6
Reel/Frame:059466/0480   Pages: 5
Recorded: 04/01/2022
Attorney Dkt #:0941-4717PUS1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors
1
WU, ZHIQIANG
Exec Dt:
03/27/2022
2
LIU, KUO-AN
Exec Dt:
03/25/2022
3
LAM, KAI TAK
Exec Dt:
03/25/2022
4
LIN, MENG-YU
Exec Dt:
03/27/2022
5
CHENG, CHUN-FU
Exec Dt:
03/25/2022
6
CHIANG, CHIEH-CHUN
Exec Dt:
03/27/2022
7
FAN, CHUN-HSIANG
Exec Dt:
03/25/2022
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
NONE
US20230317829
17710499
Correspondence name and address
BIRCH, STEWART, KOLASCH & BIRCH, LLP.
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22042
Assignment: 7
Reel/Frame:059840/0321   Pages: 4
Recorded: 05/06/2022
Attorney Dkt #:TSMC 200068US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors
1
CHEN, TAI-YU
Exec Dt:
04/19/2022
2
KHIVSARA, SAGAR DEEPAK
Exec Dt:
04/19/2022
3
CHIEN, SHANG-CHIEH
Exec Dt:
05/06/2022
4
LAM, KAI TAK
Exec Dt:
04/19/2022
5
YU, SHENG-KANG
Exec Dt:
04/19/2022
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
8, LI-HSIN RD. 6,
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
11822259
US20230333491
17722909
Correspondence name and address
FAY SHARPE LLP
1228 EUCLID AVENUE, 5TH FLOOR
THE HALLE BUILDING
CLEVELAND, 44115 UNITED STATES

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