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Patent Assignment Assignor Details
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Assignor Name : HIGON AUSTIN R&D CENTER CORPORATION
Total Assignments: 7
Assignment: 1
Reel/Frame:049252/0055   Pages: 3
Recorded: 05/22/2019
Attorney Dkt #:77785-295686
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor
1
HIGON AUSTIN R&D CENTER CORPORATION
Exec Dt:
01/02/2019
Assignee
1
CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
SUITE 22-31, 11 FLOOR, 1366 BUILDING 2
MID-SECTION OF TIANFU AVENUE
SICHUAN PROVINCE, CHINA 610041
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
11016771
US20200371807
16419121
Correspondence name and address
G. PETER NICHOLS
BARNES & THORNBURG LLP
P.O. BOX 2786
CHICAGO, IL 60690-2786
Assignment: 2
Reel/Frame:048914/0452   Pages: 3
Recorded: 04/17/2019
Attorney Dkt #:77785/294263
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor
1
HIGON AUSTIN R&D CENTER CORPORATION
Exec Dt:
01/02/2019
Assignee
1
CHENDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
SUITE 22-31, 11 FLOOR, 1366 BUILDING 2
MID -SECTION OF TIANFU AVENUE
SICHUAN PROVINCE, CHINA 610041
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
10860487
US20200334153
16386438
Correspondence name and address
BARNES & THORNBURG LLP
P.O. BOX 2786
CHICAGO, IL 60690-2786
Assignment: 3
Reel/Frame:048977/0698   Pages: 3
Recorded: 04/24/2019
Attorney Dkt #:77785/289313
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor
1
HIGON AUSTIN R&D CENTER CORPORATION
Exec Dt:
01/02/2019
Assignee
1
CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
1366 BUILDING 2, MID-SECTION OF TIANFU AVENUE, CHENGDU HI-TECH INDUSTRIAL DEVELOPMENT ZONE
SUITE 22-31, 11 FLOOR, (BLOCK E5 TIANFU SOFTWARE PARK)
SICHUAN PROVINCE, CHINA
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
11099999
US20200334160
16389135
Correspondence name and address
BARNES & THORNBURG LLP
P.O. BOX 2786
CHICAGO, IL 60690-2786
Assignment: 4
Reel/Frame:055016/0873   Pages: 3
Recorded: 01/25/2021
Attorney Dkt #:77785-291815
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor
1
HIGON AUSTIN R&D CENTER CORPORATION
Exec Dt:
03/05/2019
Assignee
1
CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
SUITE 22-31, 11 FLOOR, 1366 BUILDING 2
MID-SECTION OF TIANFU AVENUE
SICHUAN PROVINCE, CHINA 610041
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
10936506
US20200272573
16283284
Correspondence name and address
G. PETER NICHOLS
BARNES & THORNBURG LLP
P.O. BOX 2786
CHICAGO, IL 60690-2786
Assignment: 5
Reel/Frame:056242/0468   Pages: 3
Recorded: 05/14/2021
Attorney Dkt #:234802-30018
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor
1
HIGON AUSTIN R&D CENTER CORPORATION
Exec Dt:
10/01/2020
Assignee
1
HYGON INFORMATION TECHNOLOGY CO., LTD.
INDUSTRIAL INCUBATOR 3-8, NORTH 2-204
WEST HITECH ROAD, HUAYUAN INDUSTRIAL DISTRICT
TIANJIN MUNICIPALITY, CHINA
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
10956639
NONE
16731484
Correspondence name and address
LOEB & LOEB, LLP
321 N. CLARK ST.
SUITE 2300
CHICAGO, IL 60654
Assignment: 6
Reel/Frame:054545/0213   Pages: 5
Recorded: 11/30/2020
Attorney Dkt #:77785-294263
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME TO READ PREVIOUSLY RECORDED AT REEL: 048914 FRAME: 0452. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignor
1
HIGON AUSTIN R&D CENTER CORPORATION
Exec Dt:
11/13/2020
Assignee
1
CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
SUITE 22-31, 11 FLOOR, 1366 BUILDING 2
MID-SECTION OF TIANFU AVENUE
SICHUAN PROVINCE, CHINA 610041
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
10860487
US20200334153
16386438
Correspondence name and address
G. PETER NICHOLS
BARNES & THORNBURG LLP
P.O. BOX 2786
CHICAGO, IL 60690-2786
Assignment: 7
Reel/Frame:054776/0856   Pages: 3
Recorded: 12/30/2020
Attorney Dkt #:77785/289312
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor
1
HIGON AUSTIN R&D CENTER CORPORATION
Exec Dt:
11/13/2020
Assignee
1
CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
1366 BUILDING 2, MID-SECTION OF TIANFU AVENUE, CHENGDU HI-TECH INDUSTRIAL DEVELOPMENT ZONE
SUITE 22-31, 11 FLOOR (BLOCK E5 TIANFU SOFTWARE PARK)
SICHUAN PROVINCE, CHINA 610041
Property
 
Pat #
Pub #
Intl #
App #
 
 
 
 
 
 
 
 
 
 
 
10909038
US20200210340
16236552
Correspondence name and address
BARNES & THORNBURG LLP
P.O. BOX 2786
CHICAGO, IL 60690-2786

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