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10/28/2010
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12/11/2012
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01/12/2012
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03/18/2014
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01/20/2011
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07/09/2013
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07/19/2010
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01/19/2012
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10/13/2015
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01/19/2012
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09/30/2014
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01/26/2012
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05/02/2017
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01/26/2012
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01/26/2012
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04/15/2014
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01/26/2012
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12/03/2013
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07/23/2010
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01/26/2012
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07/29/2014
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07/23/2010
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01/26/2012
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11/12/2013
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07/27/2010
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02/02/2012
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08/07/2012
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01/03/2012
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08/02/2010
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03/22/2011
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08/11/2010
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12/02/2010
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03/12/2013
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02/17/2011
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03/12/2013
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08/13/2010
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02/17/2011
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03/12/2013
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08/13/2010
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02/17/2011
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01/20/2011
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02/07/2012
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07/22/2010
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11/25/2010
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06/26/2012
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12/23/2010
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04/05/2011
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08/26/2010
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12/23/2010
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09/06/2011
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09/01/2010
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03/05/2013
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04/01/2014
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09/16/2010
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03/22/2012
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09/16/2010
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03/22/2012
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11/12/2013
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09/16/2010
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03/22/2012
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10/07/2014
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09/16/2010
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03/22/2012
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07/17/2012
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09/16/2010
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03/22/2012
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07/22/2014
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09/16/2010
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03/22/2012
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09/30/2014
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09/17/2010
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03/22/2012
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12/17/2013
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09/17/2010
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03/22/2012
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12/06/2011
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09/24/2010
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01/20/2011
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SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION
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04/17/2012
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09/28/2010
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01/20/2011
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11/04/2014
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10/08/2010
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04/14/2011
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07/05/2011
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10/08/2010
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10/08/2013
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10/19/2010
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04/19/2012
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ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS
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04/30/2013
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10/20/2010
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02/10/2011
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09/20/2011
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10/20/2010
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02/10/2011
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09/03/2013
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10/27/2010
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02/24/2011
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09/29/2015
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10/27/2010
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11/03/2011
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01/14/2014
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10/27/2010
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02/17/2011
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ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES
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05/28/2013
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10/07/2010
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04/21/2011
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03/19/2013
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09/29/2010
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01/20/2011
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04/15/2014
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11/02/2010
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05/03/2012
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09/10/2013
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11/02/2010
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02/24/2011
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12/16/2014
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11/04/2010
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11/10/2011
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01/07/2014
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11/05/2010
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05/10/2012
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REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS
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12/13/2011
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11/08/2010
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03/03/2011
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05/27/2014
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11/08/2010
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03/10/2011
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10/01/2013
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11/15/2010
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05/17/2012
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05/31/2016
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11/15/2010
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05/17/2012
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MEMS ISOLATION STRUCTURES
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12/10/2013
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11/15/2010
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05/17/2012
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MOUNTING FLEXURE CONTACTS
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11/11/2014
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11/15/2010
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05/17/2012
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12/31/2013
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11/15/2010
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05/17/2012
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12/10/2013
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11/15/2010
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05/17/2012
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MOTION CONTROLLED ACTUATOR
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06/09/2015
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11/15/2010
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05/17/2012
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ACTUATOR INSIDE OF MOTION CONTROL
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12/25/2012
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11/15/2010
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05/17/2012
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01/28/2014
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11/15/2010
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05/17/2012
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MEMS ACTUATOR DEVICE
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06/23/2015
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11/15/2010
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05/17/2012
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04/30/2013
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11/15/2010
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05/17/2012
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Title:
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ROTATIONALLY DEPLOYED ACTUATORS
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Patent #:
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Issue Dt:
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12/17/2013
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Application #:
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12946657
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Filing Dt:
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11/15/2010
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Publication #:
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Pub Dt:
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05/17/2012
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Title:
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CAPILLARY ACTUATOR DEPLOYMENT
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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12946670
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Filing Dt:
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11/15/2010
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Publication #:
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Pub Dt:
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05/17/2012
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Title:
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LINEARLY DEPLOYED ACTUATORS
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Patent #:
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Issue Dt:
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01/22/2013
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Application #:
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12946680
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Filing Dt:
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11/15/2010
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Publication #:
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Pub Dt:
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05/17/2012
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Title:
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LENS BARREL WITH MEMS ACTUATORS
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Patent #:
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Issue Dt:
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02/19/2013
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Application #:
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12953994
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Filing Dt:
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11/24/2010
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Publication #:
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Pub Dt:
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05/24/2012
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Title:
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ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND VIAS CONNECTED TO THE CENTRAL CONTACTS
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Patent #:
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Issue Dt:
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04/16/2013
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Application #:
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12954207
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Filing Dt:
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11/24/2010
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Publication #:
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Pub Dt:
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06/02/2011
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Title:
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ETCHING AND CLEANING METHODS AND ETCHING AND CLEANING APPARATUSES USED THEREFOR
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Patent #:
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Issue Dt:
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04/24/2012
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Application #:
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12954735
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Filing Dt:
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11/26/2010
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Publication #:
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Pub Dt:
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06/16/2011
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Title:
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METHOD OF ROOM TEMPERATURE COVALENT BONDING
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Patent #:
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Issue Dt:
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04/10/2012
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Application #:
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12954740
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Filing Dt:
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11/26/2010
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Publication #:
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Pub Dt:
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03/24/2011
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Title:
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METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
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Patent #:
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Issue Dt:
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01/28/2014
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Application #:
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12958866
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Filing Dt:
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12/02/2010
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Publication #:
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Pub Dt:
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06/07/2012
| | | | |
Title:
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STACKED MICROELECTRONIC ASSEMBLY HAVING INTERPOSER CONNECTING ACTIVE CHIPS
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Patent #:
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Issue Dt:
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12/17/2013
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Application #:
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12962806
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Filing Dt:
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12/08/2010
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Publication #:
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Pub Dt:
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06/14/2012
| | | | |
Title:
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COMPLIANT INTERCONNECTS IN WAFERS
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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12963938
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Filing Dt:
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12/09/2010
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Publication #:
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Pub Dt:
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05/17/2012
| | | | |
Title:
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CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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12964049
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Filing Dt:
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12/09/2010
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Publication #:
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Pub Dt:
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06/14/2012
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Title:
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HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
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Patent #:
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Issue Dt:
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11/11/2014
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Application #:
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12965172
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Filing Dt:
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12/10/2010
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Publication #:
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Pub Dt:
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03/31/2011
| | | | |
Title:
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FLIP CHIP INTERCONNECTION WITH DOUBLE POST
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Patent #:
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Issue Dt:
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10/07/2014
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Application #:
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12965192
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Filing Dt:
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12/10/2010
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Publication #:
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Pub Dt:
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06/14/2012
| | | | |
Title:
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INTERCONNECT STRUCTURE
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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12970529
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Filing Dt:
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12/16/2010
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Publication #:
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Pub Dt:
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06/21/2012
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Title:
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VOID-FREE WAFER BONDING USING CHANNELS
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Patent #:
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Issue Dt:
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08/20/2013
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Application #:
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12974611
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Filing Dt:
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12/21/2010
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Publication #:
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Pub Dt:
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06/21/2012
| | | | |
Title:
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DUAL WAFER SPIN COATING
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Patent #:
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Issue Dt:
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12/25/2012
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Application #:
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12974744
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Filing Dt:
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12/21/2010
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Publication #:
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Pub Dt:
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04/28/2011
| | | | |
Title:
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MICROELECTRONIC ASSEMBLIES HAVING COMPLIANT LAYERS
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Patent #:
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Issue Dt:
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07/12/2011
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Application #:
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12982346
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Filing Dt:
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12/30/2010
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Publication #:
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Pub Dt:
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04/28/2011
| | | | |
Title:
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METHOD AND APPARATUS FOR PACKAGING CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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11/11/2014
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Application #:
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12982376
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Filing Dt:
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12/30/2010
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Publication #:
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Pub Dt:
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05/05/2011
| | | | |
Title:
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Semiconductor Die Array Structure
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Patent #:
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Issue Dt:
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11/05/2013
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Application #:
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12986556
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Filing Dt:
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01/07/2011
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Publication #:
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Pub Dt:
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04/28/2011
| | | | |
Title:
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MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT
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Patent #:
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Issue Dt:
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09/18/2012
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Application #:
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12986601
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Filing Dt:
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01/07/2011
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Publication #:
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Pub Dt:
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05/05/2011
| | | | |
Title:
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MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT
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Patent #:
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Issue Dt:
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10/15/2013
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Application #:
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12991143
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Filing Dt:
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11/05/2010
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Publication #:
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Pub Dt:
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03/10/2011
| | | | |
Title:
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METHOD FOR MANUFACTURING A CHIP-SIZE DOUBLE SIDE CONNECTION PACKAGE
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Patent #:
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Issue Dt:
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09/18/2012
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Application #:
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13008579
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Filing Dt:
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01/18/2011
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Publication #:
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Pub Dt:
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05/19/2011
| | | | |
Title:
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MULTILAYER SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT
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Patent #:
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Issue Dt:
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12/04/2012
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Application #:
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13011606
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Filing Dt:
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01/21/2011
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Publication #:
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Pub Dt:
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05/19/2011
| | | | |
Title:
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METHOD OF OPERATING INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE PROGRAMMABLE MEMORY HAVING VARIABLE COUPLING RELATED APPLICATION DATA
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Patent #:
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Issue Dt:
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08/05/2014
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Application #:
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13012847
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Filing Dt:
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01/25/2011
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Publication #:
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Pub Dt:
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07/26/2012
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Title:
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PEAK-TO-AVERAGE POWER RATIO REDUCTION FOR HYBRID FM HD RADIO TRANSMISSION
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Patent #:
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Issue Dt:
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05/20/2014
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Application #:
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13012949
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Filing Dt:
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01/25/2011
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Publication #:
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Pub Dt:
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07/07/2011
| | | | |
Title:
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MICROELECTRONIC PACKAGES AND METHODS THEREFOR
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Patent #:
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Issue Dt:
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12/09/2014
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Application #:
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13021922
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Filing Dt:
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02/07/2011
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Publication #:
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Pub Dt:
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03/08/2012
| | | | |
Title:
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SPATIAL AUDIO ENCODING AND REPRODUCTION
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Patent #:
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Issue Dt:
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08/28/2012
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Application #:
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13022068
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Filing Dt:
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02/07/2011
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Title:
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SYSTEM AND METHOD FOR GENERATING MULTIMEDIA ACCOMPANIMENTS TO BROADCAST DATA
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Patent #:
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Issue Dt:
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01/14/2014
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Application #:
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13032009
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Filing Dt:
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02/22/2011
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Publication #:
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Pub Dt:
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06/16/2011
| | | | |
Title:
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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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Patent #:
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Issue Dt:
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12/04/2012
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Application #:
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13041192
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Filing Dt:
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03/04/2011
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Publication #:
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Pub Dt:
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06/23/2011
| | | | |
Title:
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WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
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Patent #:
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Issue Dt:
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04/28/2015
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Application #:
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13042186
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Filing Dt:
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03/07/2011
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Publication #:
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Pub Dt:
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09/13/2012
| | | | |
Title:
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SUBSTRATES WITH THROUGH VIAS WITH CONDUCTIVE FEATURES FOR CONNECTION TO INTEGRATED CIRCUIT ELEMENTS, AND METHODS FOR FORMING THROUGH VIAS IN SUBSTRATES
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Patent #:
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Issue Dt:
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10/09/2012
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Application #:
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13043094
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Filing Dt:
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03/08/2011
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Publication #:
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Pub Dt:
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06/30/2011
| | | | |
Title:
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METHODS FOR FORMING THROUGH-SUBSTRATE CONDUCTOR FILLED VIAS, AND ELECTRONIC ASSEMBLIES FORMED USING SUCH METHODS
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Patent #:
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Issue Dt:
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05/10/2016
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Application #:
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13048428
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Filing Dt:
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03/15/2011
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Title:
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SYSTEM AND METHOD FOR GENERATING MULTIMEDIA ACCOMPANIMENTS TO BROADCAST DATA
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Patent #:
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Issue Dt:
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08/28/2012
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Application #:
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13048493
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Filing Dt:
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03/15/2011
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Title:
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SYSTEM AND METHOD FOR GENERATING MULTIMEDIA ACCOMPANIMENTS TO BROADCAST DATA
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Patent #:
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Issue Dt:
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10/09/2012
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13049307
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Filing Dt:
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03/16/2011
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Publication #:
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Pub Dt:
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07/07/2011
| | | | |
Title:
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WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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11/19/2013
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Application #:
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13051414
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Filing Dt:
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03/18/2011
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Publication #:
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Pub Dt:
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06/07/2012
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Title:
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STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PLURAL ACTIVE CHIPS
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Patent #:
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Issue Dt:
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05/27/2014
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Application #:
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13051424
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Filing Dt:
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03/18/2011
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Publication #:
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Pub Dt:
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06/07/2012
| | | | |
Title:
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STACKED MICROELECTRONIC ASSEMBY WITH TSVS FORMED IN STAGES AND CARRIER ABOVE CHIP
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Patent #:
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Issue Dt:
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07/05/2016
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Application #:
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13053088
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Filing Dt:
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03/21/2011
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Pub Dt:
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07/14/2011
| | | | |
Title:
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SYSTEMS AND METHODS FOR REDUCING AUDIO NOISE
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Patent #:
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Issue Dt:
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03/26/2013
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Application #:
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13067660
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Filing Dt:
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06/17/2011
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Publication #:
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Pub Dt:
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02/02/2012
| | | | |
Title:
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SEMICONDUCTOR DEVICE AND MULTILAYER SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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13076969
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Filing Dt:
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03/31/2011
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Publication #:
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Pub Dt:
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06/21/2012
| | | | |
Title:
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SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING
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