Patent Assignment Details
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Reel/Frame: | 021332/0001 | |
| Pages: | 5 |
| | Recorded: | 07/22/2008 | | |
Attorney Dkt #: | 8733.990.10 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/2010
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Application #:
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12219446
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Filing Dt:
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07/22/2008
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Publication #:
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Pub Dt:
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11/20/2008
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Title:
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ETCHING SOLUTION FOR MULTIPLE LAYER OF COPPER AND MOLYBDENUM AND ETCHING METHOD USING THE SAME
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Assignees
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20 YOIDO-DONG, YOUNGDUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF |
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740-30-HO, SINHEUNG-DONG, IKSAN-SI, JEOLLABUK-DO |
SEOUL, KOREA, REPUBLIC OF |
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Correspondence name and address
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SONG K. JUNG
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MCKENNA LONG & ALDRIDGE LLP
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1900 K STREET, N.W.
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WASHINGTON, D.C. 20006
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