Total properties:
45
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Patent #:
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Issue Dt:
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01/27/2004
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Application #:
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09583183
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Filing Dt:
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05/30/2000
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Title:
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MULTI-STACKED MEMORY PACKAGE
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Patent #:
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Issue Dt:
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02/24/2004
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Application #:
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09602195
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Filing Dt:
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06/22/2000
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Title:
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ASSEMBLY FOR TRANSPORTING MATERIAL
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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09648284
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Filing Dt:
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08/24/2000
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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01/13/2004
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Application #:
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09687487
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Filing Dt:
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10/13/2000
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Title:
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CLAMP AND HEAT BLOCK ASSEMBLY FOR WIRE BONDING A SEMICONDUCTOR PACKAGE ASSEMBLY
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Patent #:
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Issue Dt:
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06/22/2004
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Application #:
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09687495
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Filing Dt:
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10/13/2000
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Title:
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ENCAPSULATED SEMICONDUCTOR PACKAGE INCLUDING CHIP PADDLE AND LEADS
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Patent #:
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Issue Dt:
|
05/04/2004
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Application #:
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09687530
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Filing Dt:
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10/13/2000
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
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Patent #:
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Issue Dt:
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01/13/2004
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Application #:
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09687536
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Filing Dt:
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10/13/2000
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Title:
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END GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
02/24/2004
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Application #:
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09687585
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Filing Dt:
|
10/13/2000
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Title:
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SEMICONDUCTOR PACKAGE HAVING REDUCED THICKNESS
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Patent #:
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Issue Dt:
|
01/06/2004
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Application #:
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09751536
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Filing Dt:
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12/29/2000
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Title:
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OPTICAL FIBER HAVING TAPERED END AND OPTICAL CONNECTOR WITH RECIPROCAL OPENING
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Patent #:
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Issue Dt:
|
02/03/2004
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Application #:
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09764165
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Filing Dt:
|
01/16/2001
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Title:
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OPTICAL MODULE WITH LENS INTEGRAL HOLDER
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Patent #:
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Issue Dt:
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07/13/2004
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Application #:
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09774952
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Filing Dt:
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01/30/2001
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Publication #:
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Pub Dt:
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06/28/2001
| | | | |
Title:
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SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL APERTURE OF SUBSTRATE
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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09816599
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Filing Dt:
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03/23/2001
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Publication #:
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Pub Dt:
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01/02/2003
| | | | |
Title:
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SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS WITH ALIGNED INPUT/OUTPUT PADS
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Patent #:
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Issue Dt:
|
06/29/2004
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Application #:
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09827791
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Filing Dt:
|
04/06/2001
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Title:
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MAKING TWO LEAD SURFACE MOUNTING HIGH POWER MICROLEADFRAME SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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09/14/2004
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Application #:
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09829341
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Filing Dt:
|
04/09/2001
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Title:
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STACKABLE LEAD FRAME PACKAGE USING EXPOSED INTERNAL LEAD TRACES
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|
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Patent #:
|
|
Issue Dt:
|
03/16/2004
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Application #:
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09848932
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Filing Dt:
|
05/04/2001
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Title:
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SHIELDED SEMICONDUCTOR PACKAGE WITH SINGLE-SIDED SUBSTRATE AND METHOD FOR MAKING THE SAME
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|
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Patent #:
|
|
Issue Dt:
|
02/03/2004
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Application #:
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09855244
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Filing Dt:
|
05/14/2001
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Title:
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MULTI-CHIP SEMICONDUCTOR PACKAGE WITH INTEGRAL SHIELD AND ANTENNA
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|
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Patent #:
|
|
Issue Dt:
|
05/11/2004
|
Application #:
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09896014
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Filing Dt:
|
06/28/2001
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Title:
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METHOD FOR FORMING AN IMAGE SENSOR PACKAGE WITH VISION DIE IN LENS HOUSING
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|
|
Patent #:
|
|
Issue Dt:
|
05/04/2004
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Application #:
|
09896074
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Filing Dt:
|
06/28/2001
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Title:
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PRE-DRILLED IMAGE SENSOR PACKAGE FABRICATION METHOD
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|
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Patent #:
|
|
Issue Dt:
|
04/06/2004
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Application #:
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09906868
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Filing Dt:
|
07/16/2001
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Title:
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METHOD OF FABRICATING AND USING AN IMAGE SENSOR PACKAGE WITH REFLECTOR
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|
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Patent #:
|
|
Issue Dt:
|
02/03/2004
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Application #:
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09906992
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Filing Dt:
|
07/16/2001
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Title:
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IMAGE SENSOR PACKAGE WITH REFLECTOR
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|
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Patent #:
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|
Issue Dt:
|
08/31/2004
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Application #:
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09931144
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Filing Dt:
|
08/16/2001
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Title:
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SOLDERABLE INJECTION-MOLDED INTEGRATED CIRCUIT SUBSTRATE AND METHOD THEREFOR
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|
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Patent #:
|
|
Issue Dt:
|
07/06/2004
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Application #:
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09946861
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Filing Dt:
|
09/04/2001
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Title:
|
QUICK SEALING GLASS-LIDDED PACKAGE FABRICATION METHOD
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|
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Patent #:
|
|
Issue Dt:
|
02/03/2004
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Application #:
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09996226
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Filing Dt:
|
11/27/2001
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Title:
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MULTI-LAYER LEAD FRAME STRUCTURE
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|
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Patent #:
|
|
Issue Dt:
|
02/03/2004
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Application #:
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10007337
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Filing Dt:
|
10/22/2001
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Publication #:
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|
Pub Dt:
|
04/04/2002
| | | | |
Title:
|
METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
03/30/2004
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Application #:
|
10013160
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Filing Dt:
|
12/10/2001
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Publication #:
|
|
Pub Dt:
|
10/03/2002
| | | | |
Title:
|
LEAD FRAME FOR SEMICONDUCTOR PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
05/18/2004
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Application #:
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10013396
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Filing Dt:
|
12/07/2001
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Title:
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STRUCTURES FOR IMPROVING HEAT DISSIPATION IN STACKED SEMICONDUCTOR PACKAGES
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|
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Patent #:
|
|
Issue Dt:
|
05/25/2004
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Application #:
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10046995
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Filing Dt:
|
01/14/2002
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Publication #:
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|
Pub Dt:
|
07/18/2002
| | | | |
Title:
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OPTICAL DEVICE PACKAGES HAVING IMPROVED CONDUCTOR EFFICIENCY, OPTICAL COUPLING AND THERMAL TRANSFER
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|
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Patent #:
|
|
Issue Dt:
|
09/28/2004
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Application #:
|
10054124
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Filing Dt:
|
01/22/2002
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING RINGS STRUCTURE CONNECTED TO LEADS WITH VERTICALLY DOWNSET INNER ENDS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/2004
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Application #:
|
10067068
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Filing Dt:
|
02/06/2002
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Title:
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THIN INTEGRATED CIRCUIT PACKAGE HAVING AN OPTICALLY TRANSPARENT WINDOW
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|
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Patent #:
|
|
Issue Dt:
|
03/23/2004
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Application #:
|
10078718
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Filing Dt:
|
02/19/2002
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Publication #:
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|
Pub Dt:
|
08/21/2003
| | | | |
Title:
|
ENHANCED CHIP SCALE PACKAGE FOR WIRE BOND DIES
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|
|
Patent #:
|
|
Issue Dt:
|
03/02/2004
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Application #:
|
10103048
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Filing Dt:
|
03/21/2002
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Publication #:
|
|
Pub Dt:
|
10/03/2002
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/03/2004
|
Application #:
|
10115218
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Filing Dt:
|
04/02/2002
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Publication #:
|
|
Pub Dt:
|
10/17/2002
| | | | |
Title:
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CARRIER FRAME AND SEMICONDUCTOR PACKAGE INCLUDING CARRIER FRAME
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|
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Patent #:
|
|
Issue Dt:
|
01/27/2004
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Application #:
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10121215
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Filing Dt:
|
04/10/2002
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Title:
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SHIELD CAP AND SEMICONDUCTOR PACKAGE INCLUDING SHIELD CAP
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|
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Patent #:
|
|
Issue Dt:
|
03/23/2004
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Application #:
|
10161963
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Filing Dt:
|
06/03/2002
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Title:
|
INJECTION MOLDED LENS-BARREL ASSEMBLY AND METHOD FOR FABRICATING LENS-BARREL AND MOUNT ASSEMBLIES
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|
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Patent #:
|
|
Issue Dt:
|
06/29/2004
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Application #:
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10171211
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Filing Dt:
|
06/11/2002
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Publication #:
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|
Pub Dt:
|
10/17/2002
| | | | |
Title:
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APPARATUS FOR ELECTRICAL TESTING OF A SUBSTRATE HAVING A PLURALITY OF TERMINALS
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|
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Patent #:
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|
Issue Dt:
|
06/08/2004
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Application #:
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10223749
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Filing Dt:
|
08/19/2002
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Title:
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INTEGRATED CIRCUIT HAVING MULTIPLE POWER/GROUND CONNECTIONS TO A SINGLE EXTERNAL TERMINAL AND METHOD THEREFOR
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|
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Patent #:
|
|
Issue Dt:
|
04/06/2004
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Application #:
|
10251410
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Filing Dt:
|
09/20/2002
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Title:
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LEAD-FRAME METHOD AND CIRCUIT MODULE ASSEMBLY INCLUDING EDGE STIFFENER
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|
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Patent #:
|
|
Issue Dt:
|
03/16/2004
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Application #:
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10256905
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Filing Dt:
|
09/26/2002
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Publication #:
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|
Pub Dt:
|
04/24/2003
| | | | |
Title:
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SEMICONDUCTOR DEVICE INCLUDING METAL STRAP ELECTRICALLY COUPLED BETWEEN SEMICONDUCTOR DIE AND METAL LEADFRAME
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|
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Patent #:
|
|
Issue Dt:
|
09/14/2004
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Application #:
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10286589
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Filing Dt:
|
10/31/2002
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Publication #:
|
|
Pub Dt:
|
03/27/2003
| | | | |
Title:
|
IMAGE SENSOR PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
04/06/2004
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Application #:
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10306627
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Filing Dt:
|
11/26/2002
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Publication #:
|
|
Pub Dt:
|
05/29/2003
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
09/28/2004
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Application #:
|
10329620
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Filing Dt:
|
12/26/2002
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Title:
|
PRE-MOLDED LEADFRAME
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|
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Patent #:
|
|
Issue Dt:
|
08/17/2004
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Application #:
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10340256
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Filing Dt:
|
01/10/2003
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Title:
|
MOUNTING FOR A PACKAGE CONTAINING A CHIP
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|
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Patent #:
|
|
Issue Dt:
|
04/20/2004
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Application #:
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10356046
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Filing Dt:
|
01/31/2003
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Publication #:
|
|
Pub Dt:
|
06/19/2003
| | | | |
Title:
|
METHOD OF MAKING A SEMICONDUCTOR PACKAGE HAVING EXPOSED METAL STRAP
|
|
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Patent #:
|
|
Issue Dt:
|
06/15/2004
|
Application #:
|
10376988
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Filing Dt:
|
02/28/2003
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Title:
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SEMICONDUCTOR PACKAGE CAPABLE OF DIE STACKING
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|
|
Patent #:
|
|
Issue Dt:
|
09/21/2004
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Application #:
|
10387801
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Filing Dt:
|
03/13/2003
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Title:
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LEADFRAME PACKAGE FOR SEMICONDUCTOR DEVICES
|
|