Patent Assignment Details
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| Reel/Frame: | 060919/0008 | |
| Pages: | 5 |
| | Recorded: | 07/26/2022 | | |
| Attorney Dkt #: | TSMP20192446US00 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA PREVIOUSLY RECORDED ON REEL 052992 FRAME 0228. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS' INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/05/2024
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Application #:
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16906659
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Filing Dt:
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06/19/2020
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Publication #:
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Pub Dt:
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08/19/2021
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Title:
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INTERCONNECT LEVEL WITH HIGH RESISTANCE LAYER AND METHOD OF FORMING THE SAME
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP
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17950 PRESTON RD., SUITE 1000
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DALLAS, TX 75252
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05/27/2024 11:49 AM
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