Patent Assignment Details
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| Reel/Frame: | 044509/0012 | |
| Pages: | 10 |
| | Recorded: | 12/29/2017 | | |
| Attorney Dkt #: | 70052.826US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/04/2020
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Application #:
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15682459
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Filing Dt:
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08/21/2017
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Publication #:
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Pub Dt:
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12/28/2017
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Title:
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WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES
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Assignee
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| 27700 SW PARKWAY AVENUE |
| WILSONVILLE, OREGON 97070 |
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Correspondence name and address
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HAYNES AND BOONE, LLP
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2323 VICTORY AVENUE, SUITE 700
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DALLAS, TX 75219
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