Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 044624/0017 | |
| Pages: | 7 |
| | Recorded: | 01/15/2018 | | |
| Attorney Dkt #: | UTACS2015SVE103 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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03/18/2008
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Application #:
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11205182
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Filing Dt:
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08/17/2005
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Publication #:
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Pub Dt:
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12/15/2005
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Title:
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HIGH DENSITY CHIP SCALE LEADFRAME PACKAGE AND METHOD OF MANUFACTURING THE PACKAGE
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Patent #:
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Issue Dt:
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01/29/2008
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Application #:
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11429248
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Filing Dt:
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05/08/2006
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Publication #:
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Pub Dt:
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09/14/2006
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Title:
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HIGH PERFORMANCE CHIP SCALE LEADFRAME PACKAGE WITH THERMAL DISSIPATING STRUCTURE AND ANNULAR ELEMENT AND METHOD OF MANUFACTURING PACKAGE
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Assignee
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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Correspondence name and address
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HORIZON IP PTE. LTD.
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7500A BEACH ROAD, #04-306/308
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THE PLAZA
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SINGAPORE, 199591 SINGAPORE
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