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Reel/Frame:031420/0018   Pages: 3
Recorded: 10/16/2013
Attorney Dkt #:81531623US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/24/2016
Application #:
14055188
Filing Dt:
10/16/2013
Publication #:
Pub Dt:
04/16/2015
Title:
APPARATUS, DEVICE AND METHOD FOR WAFER DICING
Assignors
1
Exec Dt:
10/05/2013
2
Exec Dt:
10/14/2013
3
Exec Dt:
10/14/2013
4
Exec Dt:
10/14/2013
5
Exec Dt:
10/07/2013
6
Exec Dt:
10/14/2013
Assignee
1
HIGH TECH CAMPUS 60
EINDHOVEN, NETHERLANDS NL-5656 AG
Correspondence name and address
INTELLECTUAL PROPERTY AND LICENSING NXP
411 EAST PLUMERIA DRIVE, MS41
SAN JOSE, CA 95134

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