Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 044154/0022 | |
| Pages: | 5 |
| | Recorded: | 11/16/2017 | | |
Attorney Dkt #: | AMST-AMI-11-16-17 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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03/24/2020
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Application #:
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15585842
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Filing Dt:
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05/03/2017
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Publication #:
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Pub Dt:
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11/08/2018
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Title:
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FLUORESCENCE BASED THERMOMETRY FOR PACKAGING APPLICATIONS
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Patent #:
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Issue Dt:
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04/30/2019
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Application #:
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15638798
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Filing Dt:
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06/30/2017
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Publication #:
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Pub Dt:
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01/03/2019
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Title:
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METHOD AND APPARATUS FOR WAFER LEVEL PACKAGING
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Patent #:
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Issue Dt:
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11/30/2021
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Application #:
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15651791
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Filing Dt:
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07/17/2017
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Publication #:
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Pub Dt:
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01/17/2019
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Title:
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CATHODE ASSEMBLY HAVING A DUAL POSITION MAGNETRON AND CENTRALLY FED COOLANT
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15664954
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Filing Dt:
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07/31/2017
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Publication #:
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Pub Dt:
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12/06/2018
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Title:
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SMALL VIAS IN A POLYMER LAYER DISPOSED ON A SUBSTRATE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15673478
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Filing Dt:
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08/10/2017
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Publication #:
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Pub Dt:
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02/14/2019
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Title:
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METHOD OF INCREASING EMBEDDED 3D METAL-INSULATOR-METAL (MIM) CAPACITOR CAPACITANCE DENSITY FOR WAFER LEVEL PACKAGING
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Assignee
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3050 BOWERS AVENUE |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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MOSER TABOADA/ALAN TABOADA
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1030 BROAD STREET
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SUITE 203
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SHREWSBURY, NJ 07702
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