Patent Assignment Details
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| Reel/Frame: | 058334/0023 | |
| Pages: | 8 |
| | Recorded: | 12/08/2021 | | |
| Attorney Dkt #: | 8811.0005 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17643244
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Filing Dt:
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12/08/2021
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Publication #:
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Pub Dt:
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06/30/2022
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Title:
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Semiconductor Device and Method of Forming Leadframe with Clip Bond for Electrical Interconnect
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Assignee
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS AND ASSOCIATES
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123 W. CHANDLER HEIGHTS ROAD, #12535
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CHANDLER, AZ 85248
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