Patent Assignment Details
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| Reel/Frame: | 011176/0024 | |
| Pages: | 23 |
| | Recorded: | 09/06/2000 | | |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/16/2001
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Application #:
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09152702
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Filing Dt:
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09/14/1998
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Title:
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SEMICONDUCTOR PACKAGE FOR A SEMICONDUCTOR CHIP HAVING CENTRALLY LOCATED BOTTOM BOND PADS
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Assignee
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| 1, HYANGJEONG-DONG |
| HUNGDUK-KU, CHEONGJU, KOREA, REPUBLIC OF |
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Correspondence name and address
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ALAN R. LOUDERMILK
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10950 N. BLANEY AVENUE
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SUITE B
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CUPERTINO, CA 95014
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