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Patent Assignment Details

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Reel/Frame:	017154/0025			Pages:	5
		Recorded:	10/27/2005
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 12

Patent #:	6339191	Issue Dt:	01/15/2002	Application #:	08208586	Filing Dt:	03/11/1994
Title:	PREFABRICATED SEMICONDUCTOR CHIP CARRIER

Patent #:	5819403	Issue Dt:	10/13/1998	Application #:	08465146	Filing Dt:	06/05/1995
Title:	METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP CARRIER

Patent #:	6141869	Issue Dt:	11/07/2000	Application #:	09178650	Filing Dt:	10/26/1998
Title:	APPARATUS FOR AND METHOD OF MANUFACTURING A SEMICONDUCTOR DIE CARRIER

Patent #:	6307258	Issue Dt:	10/23/2001	Application #:	09218180	Filing Dt:	12/22/1998
Title:	OPEN-CAVITY SEMICONDUCTOR DIE PACKAGE

Patent #:	6305987	Issue Dt:	10/23/2001	Application #:	09249300	Filing Dt:	02/12/1999
Title:	INTEGRATED CONNECTOR AND SEMICONDUCTOR DIE PACKAGE

Patent #:	6857173	Issue Dt:	02/22/2005	Application #:	09705710	Filing Dt:	11/06/2000
Title:	APPARATUS FOR AND METHOD OF MANUFACTURING A SEMICONDUCTOR DIE CARRIER

Patent #:	6475832	Issue Dt:	11/05/2002	Application #:	09950702	Filing Dt:	09/13/2001
Publication #:	US20020008308	Pub Dt:	01/24/2002
Title:	OPEN-CAVITY SEMICONDUCTOR DIE PACKAGE

Patent #:	6828511	Issue Dt:	12/07/2004	Application #:	09964542	Filing Dt:	09/28/2001
Publication #:	US20020053455	Pub Dt:	05/09/2002
Title:	PREFABRICATED SEMICONDUCTOR CHIP CARRIER

Patent #:	6797882	Issue Dt:	09/28/2004	Application #:	09978772	Filing Dt:	10/18/2001
Title:	DIE PACKAGE FOR CONNECTION TO A SUBSTRATE

Patent #:	6709891	Issue Dt:	03/23/2004	Application #:	10231347	Filing Dt:	08/30/2002
Publication #:	US20030003626	Pub Dt:	01/02/2003
Title:	OPEN-CAVITY SEMICONDUCTOR DIE PACKAGE

Patent #:	6977432	Issue Dt:	12/20/2005	Application #:	10755414	Filing Dt:	01/13/2004
Publication #:	US20040140542	Pub Dt:	07/22/2004
Title:	PREFABRICATED SEMICONDUCTOR CHIP CARRIER

Patent #:	7253365	Issue Dt:	08/07/2007	Application #:	10878000	Filing Dt:	06/29/2004
Publication #:	US20040232447	Pub Dt:	11/25/2004
Title:	DIE PACKAGE FOR CONNECTION TO A SUBSTRATE

Assignor

Exec Dt:

08/26/2005

Assignee

200 RESEARCH DRIVE

WILMINGTON, MASSACHUSETTS 01887

Correspondence name and address
	WEINGARTEN SCHURGIN GAGNEBIN ET AL.
	TEN POST OFFICE SQUARE
	BOSTON, MA 02109

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