Patent Assignment Details
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| Reel/Frame: | 045965/0026 | |
| Pages: | 10 |
| | Recorded: | 06/01/2018 | | |
| Attorney Dkt #: | FIS920150079US04 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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15996030
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Filing Dt:
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06/01/2018
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Publication #:
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Pub Dt:
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09/27/2018
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Title:
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Fabricating an Integrated Circuit Chip Module with Stiffening Frame and Orthogonal Heat Spreader
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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ZIP GROUP PLLC - IBM FIS
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610 KINGSVIEW LN N
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MINNEAPOLIS, MN 55447
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05/25/2024 01:26 PM
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