Patent Assignment Details
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| Reel/Frame: | 014942/0030 | |
| Pages: | 2 |
| | Recorded: | 01/27/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/10/2005
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Application #:
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10765811
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Filing Dt:
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01/27/2004
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Publication #:
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Pub Dt:
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10/14/2004
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Title:
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FLIP CHIP WITH NOVEL POWER AND GROUND ARRANGEMENT
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Assignee
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| POB 6374 |
| KARMIEL, ISRAEL 20100 |
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Correspondence name and address
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MERVELL SEMICONDUCTOR, INC.
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ERIC B. JANOFSKY
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700 FIRST AVENUE
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MAIL STOP 509
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SUNNYVALE, CA 94089
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