Patent Assignment Details
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Reel/Frame: | 034389/0030 | |
| Pages: | 2 |
| | Recorded: | 12/05/2014 | | |
Attorney Dkt #: | S279.0010US1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/31/2017
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Application #:
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14561620
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Filing Dt:
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12/05/2014
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Publication #:
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Pub Dt:
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06/11/2015
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Title:
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MULTI-LEVEL LEADFRAME WITH INTERCONNECT AREAS FOR SOLDERING CONDUCTIVE BUMPS, MULTI-LEVEL PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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A1501, TECHNOLOGY MANSION, EASTERN SOFTWARE PARK, NO. 90, WENSAN ROAD, ZHEJIANG PROVINCE |
HANGZHOU, CHINA 310012 |
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Correspondence name and address
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JUDSON K. CHAMPLIN
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900 SECOND AVENUE SOUTH
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SUITE 1400
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MINNEAPOLIS, MN 55402
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