Patent Assignment Details
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| Reel/Frame: | 042992/0031 | |
| Pages: | 3 |
| | Recorded: | 06/26/2017 | | |
| Attorney Dkt #: | I 1570 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2018
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Application #:
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15632680
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Filing Dt:
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06/26/2017
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Publication #:
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Pub Dt:
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10/12/2017
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Title:
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Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate
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Assignee
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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CLIFFORD B. PERRY
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270 N. EL CAMINO REAL
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NO. F-347
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ENCINITAS, CA 92024
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05/27/2024 12:58 PM
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