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Patent Assignment Details
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Reel/Frame:024737/0043   Pages: 3
Recorded: 07/23/2010
Conveyance: STATEMENT UNDER 37 CFR 3.37(B) & POWER OF ATTORNEY
Total properties: 1
1
Patent #:
Issue Dt:
09/11/2012
Application #:
12830754
Filing Dt:
07/06/2010
Publication #:
Pub Dt:
01/13/2011
Title:
LAYOUT FOR HIGH DENSITY CONDUCTIVE INTERCONNECTS
Assignors
1
Exec Dt:
12/23/2009
2
Exec Dt:
12/23/2009
Assignee
1
26 DEER CREEK LANE
MOUNT KISCO, NEW YORK 10549
Correspondence name and address
RICHARD J. BOTOS
LERNER, DAVID, LITTENBERG ET AL.
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090

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