Patent Assignment Details
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Reel/Frame: | 057709/0043 | |
| Pages: | 10 |
| | Recorded: | 10/05/2021 | | |
Attorney Dkt #: | REAP1168USA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/07/2023
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Application #:
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17494797
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Filing Dt:
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10/05/2021
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Publication #:
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Pub Dt:
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06/16/2022
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Title:
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Parameter calibration method and semiconductor device utilizing the same
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Assignee
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2 INNOVATION RD. II, SCIENCE PARK |
HSINCHU, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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05/31/2024 07:40 AM
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