Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 023569/0044 | |
| Pages: | 2 |
| | Recorded: | 11/25/2009 | | |
Attorney Dkt #: | Q116204 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12625682
|
Filing Dt:
|
11/25/2009
|
Publication #:
|
|
Pub Dt:
|
05/27/2010
| | | | |
Title:
|
DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
|
|
Assignee
|
|
|
1-2, SHIMOHOZUMI 1-CHOME |
OSAKA |
IBARAKI-SHI, JAPAN |
|
Correspondence name and address
|
|
SUGHRUE-265550
|
|
2100 PENNSYLVANIA AVE. NW
|
|
WASHINGTON, DC 20037-3213
|
Search Results as of:
05/25/2024 08:14 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|