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Patent Assignment Details
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Reel/Frame:026540/0045   Pages: 2
Recorded: 07/04/2011
Attorney Dkt #:100P000415US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13175947
Filing Dt:
07/04/2011
Publication #:
Pub Dt:
01/10/2013
Title:
SURFACE MOUNTED LED PACKAGE AND MANUFACTURING METHOD THEREFOR
Assignor
1
Exec Dt:
06/27/2011
Assignee
1
22 SIN MING LANE #03-83
MIDVIEW CITY, SINGAPORE 573969
Correspondence name and address
LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
2820 SHAWN LEIGH DR
VIENNA, VA 22181

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