Total properties:
59
|
|
Patent #:
|
|
Issue Dt:
|
02/18/1997
|
Application #:
|
08511423
|
Filing Dt:
|
08/04/1995
|
Title:
|
INTEGRATED PRINTED CIRCUIT CONNECTOR AND GROUND CLIP ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
09/08/1998
|
Application #:
|
08550321
|
Filing Dt:
|
10/30/1995
|
Title:
|
SOLDER PROCESS FOR ENHANCING RELIABILITY OF MULTILAYER HYBRID CIRCUITS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/08/1998
|
Application #:
|
08591814
|
Filing Dt:
|
01/25/1996
|
Title:
|
ELECTRICAL TERMINAL APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/20/1998
|
Application #:
|
08617706
|
Filing Dt:
|
04/01/1996
|
Title:
|
LCD CONNECTOR ALIGNMENT WITH PRINTED WIRING BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/1997
|
Application #:
|
08644763
|
Filing Dt:
|
05/10/1996
|
Title:
|
VENT CAP FOR ELECTRONIC PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/08/1998
|
Application #:
|
08709886
|
Filing Dt:
|
09/09/1996
|
Title:
|
DUAL-SOLDER PROCESS FOR ENHANCING RELIABILITY OF THICK-FILM HYBRID CIRCUITS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/30/1998
|
Application #:
|
08721396
|
Filing Dt:
|
09/26/1996
|
Title:
|
ELECTRONIC CIRCUIT WITH ITEGRATED TERMINAL PINS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/18/1998
|
Application #:
|
08756128
|
Filing Dt:
|
11/25/1996
|
Title:
|
DIRECTIONAL FLOW CONTROL DEVICE FOR A WAVE SOLDERING APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/15/2001
|
Application #:
|
08799057
|
Filing Dt:
|
02/10/1997
|
Title:
|
BRACKET FOR SUPPORTING AND ALIGNING A CIRCUIT COMPONENT WITH RESPECT TO A CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
02/16/1999
|
Application #:
|
08883989
|
Filing Dt:
|
06/27/1997
|
Title:
|
MOLDED HOUSING WITH EMI SHIELD
|
|
|
Patent #:
|
|
Issue Dt:
|
06/06/2000
|
Application #:
|
09016908
|
Filing Dt:
|
02/02/1998
|
Title:
|
METHOD OF SIMULTANEOUSLY ATTACHING SURFACE-MOUNT AND CHIP-ON-BOARD DIES TO A CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
08/17/1999
|
Application #:
|
09070070
|
Filing Dt:
|
04/30/1998
|
Title:
|
FATIGUE-RESISTANT LEAD-FREE ALLOY
|
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2000
|
Application #:
|
09177586
|
Filing Dt:
|
10/23/1998
|
Title:
|
THROUGH HOLE CIRCUIT BOARD INTERCONNECT
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2001
|
Application #:
|
09286324
|
Filing Dt:
|
04/05/1999
|
Title:
|
CONDUCTOR PATTERN FOR SURFACE MOUNT DEVICES AND METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2003
|
Application #:
|
09286325
|
Filing Dt:
|
04/05/1999
|
Title:
|
METHOD OF ATTACHING SURFACE MOUNT DEVICES WITH SOLDER
|
|
|
Patent #:
|
|
Issue Dt:
|
06/11/2002
|
Application #:
|
09435843
|
Filing Dt:
|
11/08/1999
|
Title:
|
METHOD FOR FORMING SOLDER BUMPS USING A SOLDER JETTING DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2001
|
Application #:
|
09467502
|
Filing Dt:
|
12/20/1999
|
Title:
|
HIGH DENSITY WIREBOND CONNECTOR ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
04/23/2002
|
Application #:
|
09482777
|
Filing Dt:
|
01/13/2000
|
Title:
|
PROCESS FOR PREVENTING THE FORMATION OF A COPPER PRECIPITATE IN A COPPER-CONTAINING METALLIZATION ON A DIE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2002
|
Application #:
|
09500931
|
Filing Dt:
|
02/15/2000
|
Title:
|
PWB ESD DISCHARGER
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2003
|
Application #:
|
09560981
|
Filing Dt:
|
04/28/2000
|
Title:
|
COMBINATION CIRCUIT BOARD AND SEGMENTED CONDUCTIVE BUS SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/30/2002
|
Application #:
|
09666749
|
Filing Dt:
|
09/21/2000
|
Title:
|
ENCLOSURE FOR ELECTRONIC COMPONENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/02/2003
|
Application #:
|
09692886
|
Filing Dt:
|
10/23/2000
|
Title:
|
ELECTRONIC PACKAGE AND METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/2003
|
Application #:
|
09715710
|
Filing Dt:
|
11/20/2000
|
Title:
|
METHOD FOR SOLDERING A LEADED CIRCUIT COMPONENT AND TWO-PARK SOLDER ALLOY PREFORM THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
04/08/2003
|
Application #:
|
09789124
|
Filing Dt:
|
02/20/2001
|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
|
OPTICAL DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/08/2003
|
Application #:
|
09789125
|
Filing Dt:
|
02/20/2001
|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
|
OPTICAL MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/08/2003
|
Application #:
|
09789317
|
Filing Dt:
|
02/20/2001
|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
|
OPTICAL ALIGNMENT SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/2003
|
Application #:
|
09844575
|
Filing Dt:
|
04/30/2001
|
Publication #:
|
|
Pub Dt:
|
10/31/2002
| | | | |
Title:
|
TECHNIQUE FOR SURFACE MOUNTING ELECTRICAL COMPONENTS TO A CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2003
|
Application #:
|
09850626
|
Filing Dt:
|
05/07/2001
|
Publication #:
|
|
Pub Dt:
|
10/18/2001
| | | | |
Title:
|
HIGH DENSITY WIREBOND CONNECTOR ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/2003
|
Application #:
|
09851393
|
Filing Dt:
|
05/09/2001
|
Publication #:
|
|
Pub Dt:
|
11/14/2002
| | | | |
Title:
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/18/2005
|
Application #:
|
09920366
|
Filing Dt:
|
08/01/2001
|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
Title:
|
OPTICAL DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/15/2003
|
Application #:
|
10124782
|
Filing Dt:
|
04/17/2002
|
Title:
|
INTEGRATED CIRCUIT ASSEMBLY WITH BAR BOND ATTACHMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
05/27/2003
|
Application #:
|
10175094
|
Filing Dt:
|
06/18/2002
|
Title:
|
AUTOMOTIVE ELECTRONICS CONTROL MODULE ENCLOSURE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2004
|
Application #:
|
10177940
|
Filing Dt:
|
06/21/2002
|
Publication #:
|
|
Pub Dt:
|
12/25/2003
| | | | |
Title:
|
METHOD OF MOUNTING A LEADLESS PACKAGE AND STRUCTURE THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
05/10/2005
|
Application #:
|
10230021
|
Filing Dt:
|
08/28/2002
|
Publication #:
|
|
Pub Dt:
|
03/04/2004
| | | | |
Title:
|
LEAD PROTUSION TESTER
|
|
|
Patent #:
|
|
Issue Dt:
|
10/07/2003
|
Application #:
|
10252502
|
Filing Dt:
|
09/23/2002
|
Title:
|
LEACH-RESISTANT SOLDER ALLOYS FOR SILVER-BASED THICK-FILM CONDUCTORS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/14/2004
|
Application #:
|
10268327
|
Filing Dt:
|
10/10/2002
|
Publication #:
|
|
Pub Dt:
|
04/15/2004
| | | | |
Title:
|
TWISTED FLAT ELECTRICAL TERMINAL
|
|
|
Patent #:
|
|
Issue Dt:
|
12/21/2004
|
Application #:
|
10321900
|
Filing Dt:
|
12/17/2002
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
Title:
|
MULTI-CHIP MODULE AND METHOD OF FORMING
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2005
|
Application #:
|
10352795
|
Filing Dt:
|
01/28/2003
|
Publication #:
|
|
Pub Dt:
|
01/01/2004
| | | | |
Title:
|
OPTICAL DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/14/2006
|
Application #:
|
10352798
|
Filing Dt:
|
01/28/2003
|
Publication #:
|
|
Pub Dt:
|
11/27/2003
| | | | |
Title:
|
OPTICAL MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2005
|
Application #:
|
10408937
|
Filing Dt:
|
04/08/2003
|
Publication #:
|
|
Pub Dt:
|
10/14/2004
| | | | |
Title:
|
CIRCUITRY FOR MEASURING MECHANICAL STRESS IMPRESSED ON A PRINTED CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
01/17/2006
|
Application #:
|
10616617
|
Filing Dt:
|
07/10/2003
|
Publication #:
|
|
Pub Dt:
|
01/13/2005
| | | | |
Title:
|
ELECTRONIC PACKAGE HAVING CONTROLLED HEIGHT STAND-OFF SOLDER JOINT
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2005
|
Application #:
|
10628823
|
Filing Dt:
|
07/28/2003
|
Publication #:
|
|
Pub Dt:
|
02/12/2004
| | | | |
Title:
|
TECHNIQUE FOR SURFACE MOUNTING ELECTRICAL COMPONENTS TO A CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2006
|
Application #:
|
10639794
|
Filing Dt:
|
08/12/2003
|
Publication #:
|
|
Pub Dt:
|
02/17/2005
| | | | |
Title:
|
FABRICATION OF THICK FILM ELECTRICAL COMPONENTS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2006
|
Application #:
|
10707004
|
Filing Dt:
|
11/13/2003
|
Publication #:
|
|
Pub Dt:
|
05/19/2005
| | | | |
Title:
|
ELECTRONIC MODULE WITH REMOVABLE CIRCUITRY AND METHOD THEREFOR
|
|
|
Patent #:
|
|
Issue Dt:
|
08/22/2006
|
Application #:
|
10717839
|
Filing Dt:
|
11/20/2003
|
Publication #:
|
|
Pub Dt:
|
05/26/2005
| | | | |
Title:
|
CIRCUIT BOARD WITH LOCALIZED STIFFENER FOR ENHANCED CIRCUIT COMPONENT RELIABILITY
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2005
|
Application #:
|
10784350
|
Filing Dt:
|
02/23/2004
|
Title:
|
TECHNIQUE FOR CONNECTOR TO PRINTED CIRCUIT BOARD DECOUPLING TO ELIMINATE FLEXURE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2005
|
Application #:
|
10828848
|
Filing Dt:
|
04/20/2004
|
Title:
|
TECHNIQUE FOR CALIBRATING A CURRENT CONTROL CIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
05/02/2006
|
Application #:
|
10919864
|
Filing Dt:
|
08/17/2004
|
Publication #:
|
|
Pub Dt:
|
02/23/2006
| | | | |
Title:
|
MULTI-PATH BAR BOND CONNECTOR FOR AN INTEGRATED CIRCUIT ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2007
|
Application #:
|
10940872
|
Filing Dt:
|
09/14/2004
|
Publication #:
|
|
Pub Dt:
|
03/16/2006
| | | | |
Title:
|
DISCRETE CIRCUIT FOR DRIVING FIELD EFFECT TRANSISTORS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2005
|
Application #:
|
11053129
|
Filing Dt:
|
02/08/2005
|
Title:
|
SEALED ELECTRONIC MODULE WITH SEAL-IN-PLACE CONNECTOR HEADER
|
|
|
Patent #:
|
|
Issue Dt:
|
05/06/2008
|
Application #:
|
11181530
|
Filing Dt:
|
07/14/2005
|
Publication #:
|
|
Pub Dt:
|
11/10/2005
| | | | |
Title:
|
OPTICAL DEVICE WITH ALIGNMENT COMPENSATION
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2008
|
Application #:
|
11191864
|
Filing Dt:
|
07/28/2005
|
Publication #:
|
|
Pub Dt:
|
02/01/2007
| | | | |
Title:
|
SURFACE MOUNT CONNECTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2007
|
Application #:
|
11213141
|
Filing Dt:
|
08/26/2005
|
Publication #:
|
|
Pub Dt:
|
03/01/2007
| | | | |
Title:
|
ELECTRONIC PACKAGE AND CIRCUIT BOARD HAVING SEGMENTED CONTACT PADS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/26/2009
|
Application #:
|
11471869
|
Filing Dt:
|
06/21/2006
|
Publication #:
|
|
Pub Dt:
|
12/27/2007
| | | | |
Title:
|
MANUFACTURING METHOD FOR A LEADLESS MULTI-CHIP ELECTRONIC MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/21/2009
|
Application #:
|
11523985
|
Filing Dt:
|
09/20/2006
|
Publication #:
|
|
Pub Dt:
|
03/20/2008
| | | | |
Title:
|
ELECTRONIC ENCLOSURE WITH CONTINUOUS GROUND CONTACT SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2007
|
Application #:
|
11533494
|
Filing Dt:
|
09/20/2006
|
Title:
|
ELECTRONICS ENCLOSURE AND METHOD OF FABRICATING AN ELECTRONICS ENCLOSURE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/27/2009
|
Application #:
|
11586456
|
Filing Dt:
|
10/25/2006
|
Publication #:
|
|
Pub Dt:
|
05/01/2008
| | | | |
Title:
|
METHOD OF ANALYZING ELECTRICAL CONNECTION AND TEST SYSTEM
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2008
|
Application #:
|
11712718
|
Filing Dt:
|
03/01/2007
|
Publication #:
|
|
Pub Dt:
|
09/04/2008
| | | | |
Title:
|
COMPRESSION CONNECTION FOR VERTICAL IC PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2010
|
Application #:
|
11891067
|
Filing Dt:
|
08/08/2007
|
Publication #:
|
|
Pub Dt:
|
02/12/2009
| | | | |
Title:
|
EMBEDDED RESISTOR AND CAPACITOR CIRCUIT AND METHOD OF FABRICATING SAME
|
|