skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:042382/0045   Pages: 4
Recorded: 05/15/2017
Attorney Dkt #:FLEX-00000
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 10
1
Patent #:
Issue Dt:
08/24/2010
Application #:
11828196
Filing Dt:
07/25/2007
Publication #:
Pub Dt:
08/28/2008
Title:
EMBEDDING AN ELECTRONIC COMPONENT BETWEEN SURFACES OF A PRINTED CIRCUIT BOARD
2
Patent #:
Issue Dt:
06/05/2012
Application #:
12079777
Filing Dt:
03/28/2008
Publication #:
Pub Dt:
10/02/2008
Title:
METHOD OF PRODUCING A MULTI-TURN COIL FROM FOLDED FLEXIBLE CIRCUITRY
3
Patent #:
Issue Dt:
03/05/2013
Application #:
12940701
Filing Dt:
11/05/2010
Publication #:
Pub Dt:
03/03/2011
Title:
A MULTI-TURN COIL DEVICE
4
Patent #:
Issue Dt:
11/06/2012
Application #:
13042601
Filing Dt:
03/08/2011
Publication #:
Pub Dt:
10/06/2011
Title:
METHOD FOR BACKDRILLING VIA STUBS OF MULTILAYER PRINTED CIRCUIT BOARDS WITH REDUCED BACKDRILL DIAMETERS
5
Patent #:
Issue Dt:
01/05/2016
Application #:
13753422
Filing Dt:
01/29/2013
Title:
METHOD OF MAKING AN INLAY PCB WITH EMBEDDED COIN
6
Patent #:
Issue Dt:
08/25/2015
Application #:
13763214
Filing Dt:
02/08/2013
Title:
USE OF FLEXIBLE CIRCUITS INCORPORATING A HEAT SPREADING LAYER AND THE RIGIDIZING SPECIFIC AREAS WITHIN SUCH A CONSTRUCTION BY CREATING STIFFENING STRUCTURES WITHIN SAID CIRCUITS BY EITHER FOLDING, BENDING, FORMING OR COMBINATIONS THEREOF
7
Patent #:
Issue Dt:
05/30/2017
Application #:
13897253
Filing Dt:
05/17/2013
Title:
INLAY PCB WITH EMBEDDED COIN BOARD
8
Patent #:
Issue Dt:
12/13/2016
Application #:
14463361
Filing Dt:
08/19/2014
Title:
EMBEDDED COMPONENTS IN A SUBSTRATE
9
Patent #:
Issue Dt:
05/23/2017
Application #:
14476549
Filing Dt:
09/03/2014
Title:
EMBEDDED COINS FOR HDI OR SEQ LAMINATIONS
10
Patent #:
Issue Dt:
02/07/2017
Application #:
14524894
Filing Dt:
10/27/2014
Publication #:
Pub Dt:
04/30/2015
Title:
NANO-COPPER SOLDER FOR FILLING THERMAL VIAS
Assignor
1
Exec Dt:
05/11/2017
Assignee
1
6201 AMERICA CENTER DRIVE
SAN JOSE, CALIFORNIA 95002
Correspondence name and address
THOMAS B. HAVERSTOCK
162 NORTH WOLFE ROAD
SUNNYVALE, CA 94086

Search Results as of: 06/06/2024 01:49 PM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT