Patent Assignment Details
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Reel/Frame: | 034852/0047 | |
| Pages: | 3 |
| | Recorded: | 01/30/2015 | | |
Attorney Dkt #: | 079538-8001.US00 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/09/2016
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Application #:
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13383555
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Filing Dt:
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05/03/2013
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Publication #:
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Pub Dt:
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08/15/2013
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Title:
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METHOD FOR MEASURING THICKNESS OF FILM ON WAFER EDGE
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Assignee
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#8 BUILDING, NO. 9 JUXING RD., HAIHE SCI-TECH PARK |
JINNAN DISTRICT |
TIANJIN, CHINA 300350 |
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Correspondence name and address
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BING AI
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PERKINS COIE LLP
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PO BOX 1247
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SEATTLE, WA 98111-1247
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