Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 021650/0048 | |
| Pages: | 5 |
| | Recorded: | 10/08/2008 | | |
| Attorney Dkt #: | 27-562 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/10/2013
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Application #:
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12236445
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Filing Dt:
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09/23/2008
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Publication #:
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Pub Dt:
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03/25/2010
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Title:
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PLANAR ENCAPSULATION AND MOLD CAVITY PACKAGE IN PACKAGE SYSTEM
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL
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SUITE 330
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SUNNYVALE, CA 94087
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