Patent Assignment Details
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| Reel/Frame: | 034595/0048 | |
| Pages: | 3 |
| | Recorded: | 12/29/2014 | | |
| Attorney Dkt #: | CCTWP004 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/26/2016
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Application #:
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14584616
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Filing Dt:
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12/29/2014
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Publication #:
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Pub Dt:
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07/02/2015
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Title:
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MULTI-LEVEL PACKAGE ASSEMBLY HAVING CONDUCTIVE VIAS COUPLED TO CHIP CARRIER FOR EACH LEVEL AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| A1501, TECHNOLOGY MANSION, EASTERN SOFTWARE PARK |
| NO. 90 WENSAN ROAD |
| HANGZHOU, ZHEJIANG, CHINA |
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Correspondence name and address
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BEYER LAW GROUP LLP
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P. O. BOX 51887
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PALO ALTO, CA 94303-1887
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