Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 037437/0049 | |
| Pages: | 13 |
| | Recorded: | 11/30/2015 | | |
| Attorney Dkt #: | 5610/0314M |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
10
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/16/2014
|
Application #:
|
12900663
|
Filing Dt:
|
10/08/2010
|
|
Publication #:
|
|
Pub Dt:
|
04/12/2012
| | | | |
|
Title:
|
DICING-FREE LED FABRICATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/2014
|
Application #:
|
13286562
|
Filing Dt:
|
11/01/2011
|
|
Publication #:
|
|
Pub Dt:
|
05/02/2013
| | | | |
|
Title:
|
LED MODULE AND METHOD OF BONDING THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/03/2013
|
Application #:
|
13557272
|
Filing Dt:
|
07/25/2012
|
|
Publication #:
|
|
Pub Dt:
|
11/15/2012
| | | | |
|
Title:
|
METHODS OF FABRICATING LIGHT EMITTING DIODE PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/25/2014
|
Application #:
|
14153347
|
Filing Dt:
|
01/13/2014
|
|
Publication #:
|
|
Pub Dt:
|
04/24/2014
| | | | |
|
Title:
|
LED MODULE AND METHOD OF BONDING THEREOF
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14472495
|
Filing Dt:
|
08/29/2014
|
|
Publication #:
|
|
Pub Dt:
|
02/26/2015
| | | | |
|
Title:
|
LIGHT-EMITTING DIODE WITH CURRENT-SPREADING REGION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/02/2018
|
Application #:
|
14549596
|
Filing Dt:
|
11/21/2014
|
|
Publication #:
|
|
Pub Dt:
|
03/19/2015
| | | | |
|
Title:
|
LED MODULE AND METHOD OF BONDING THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2016
|
Application #:
|
14556273
|
Filing Dt:
|
12/01/2014
|
|
Publication #:
|
|
Pub Dt:
|
03/26/2015
| | | | |
|
Title:
|
VERTICAL LED CHIP PACKAGE ON TSV CARRIER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/22/2016
|
Application #:
|
14556318
|
Filing Dt:
|
12/01/2014
|
|
Publication #:
|
|
Pub Dt:
|
05/07/2015
| | | | |
|
Title:
|
THERMAL PROTECTION STRUCTURE FOR MULTI-JUNCTION LED MODULE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14558788
|
Filing Dt:
|
12/03/2014
|
|
Publication #:
|
|
Pub Dt:
|
03/26/2015
| | | | |
|
Title:
|
LIGHT-EMITTING DIODE LAMP AND METHOD OF MAKING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/18/2016
|
Application #:
|
14566782
|
Filing Dt:
|
12/11/2014
|
|
Publication #:
|
|
Pub Dt:
|
04/02/2015
| | | | |
|
Title:
|
DICING-FREE LED FABRICATION
|
|
|
Assignee
|
|
|
|
|
| 5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
|
|
Correspondence name and address
|
| |
MUNCY, GEISSLER, OLDS & LOWE, P.C.
|
| |
4000 LEGATO ROAD
|
| |
SUITE 310
|
| |
FAIRFAX, VA 22033
|
Search Results as of:
06/14/2024 03:37 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
