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Patent Assignment Details
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Reel/Frame:054509/0049   Pages: 5
Recorded: 12/01/2020
Attorney Dkt #:TSMC TO MTL
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 6
1
Patent #:
Issue Dt:
04/22/2008
Application #:
11082298
Filing Dt:
03/17/2005
Publication #:
Pub Dt:
10/05/2006
Title:
REDUCING CRACKING OF HIGH-LEAD OR LEAD-FREE BUMPS BY MATCHING SIZES OF CONTACT PADS AND BUMP PADS
2
Patent #:
Issue Dt:
06/09/2009
Application #:
11087863
Filing Dt:
03/24/2005
Publication #:
Pub Dt:
09/28/2006
Title:
DUMMY VIA FOR REDUCING PROXIMITY EFFECT AND METHOD OF USING THE SAME
3
Patent #:
Issue Dt:
02/28/2012
Application #:
11778558
Filing Dt:
07/16/2007
Publication #:
Pub Dt:
01/22/2009
Title:
METHOD FOR RESHAPING SILICON SURFACES WITH SHALLOW TRENCH ISOLATION
4
Patent #:
Issue Dt:
03/05/2013
Application #:
12390668
Filing Dt:
02/23/2009
Publication #:
Pub Dt:
08/26/2010
Title:
METAL STRUCTURE FOR MEMORY DEVICE
5
Patent #:
Issue Dt:
08/28/2012
Application #:
13221654
Filing Dt:
08/30/2011
Publication #:
Pub Dt:
12/22/2011
Title:
METHOD FOR RESHAPING SILICON SURFACES WITH SHALLOW TRENCH ISOLATION
6
Patent #:
Issue Dt:
04/08/2014
Application #:
13774797
Filing Dt:
02/22/2013
Publication #:
Pub Dt:
06/27/2013
Title:
Metal Structure for Memory Device
Assignor
1
Exec Dt:
11/19/2020
Assignee
1
ONE MICROSOFT WAY
REDMOND, WASHINGTON 98052
Correspondence name and address
MICROSOFT TECHNOLOGY LICENSING, LLC
ONE MICROSOFT WAY
REDMOND, WA 98052

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