Patent Assignment Details
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| Reel/Frame: | 056814/0052 | |
| Pages: | 5 |
| | Recorded: | 07/12/2021 | | |
| Attorney Dkt #: | 107033-1218570(001100US) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/21/2024
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Application #:
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17372530
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Filing Dt:
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07/12/2021
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Publication #:
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Pub Dt:
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10/28/2021
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Title:
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METHOD FOR PACKAGING SEMICONDUCTOR, SEMICONDUCTOR PACKAGE STRUCTURE, AND PACKAGE
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Assignee
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| NO.388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK, ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA, |
| HEFEI, CHINA |
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Correspondence name and address
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KILPATRICK TOWNSEND & STOCKTON LLP - WES
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1100 PEACHTREE STREET
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SUITE 2800
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ATLANTA, GA 30309
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05/24/2024 07:16 AM
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