Patent Assignment Details
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| Reel/Frame: | 053754/0054 | |
| Pages: | 4 |
| | Recorded: | 09/13/2020 | | |
| Attorney Dkt #: | 10094740-50519316-CON |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/26/2022
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Application #:
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17019303
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Filing Dt:
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09/13/2020
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Publication #:
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Pub Dt:
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12/31/2020
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Title:
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METHOD OF ASSEMBLING MICROELECTRONIC PACKAGE AND METHOD OF OPERATING THE SAME
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Assignee
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| 10F-1 NO. 1, TAIYUAN 1ST STREET |
| ZHUBEI CITY |
| HSINCHU COUNTY, TAIWAN 30288 |
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Correspondence name and address
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HUFFMAN LAW GROUP, P.C.
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6925 SNOW MASS DR.
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COLORADO SPRINGS, CO 80908
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05/31/2024 01:51 AM
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