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Patent Assignment Details
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Reel/Frame:015442/0056   Pages: 2
Recorded: 06/09/2004
Attorney Dkt #:3183-74
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 6
1
Patent #:
Issue Dt:
03/07/2000
Application #:
09270802
Filing Dt:
03/17/1999
Title:
FLAT MULTIPLE-CHIP MODULE MICRO BALL GRID ARRAY PACKAGING
2
Patent #:
Issue Dt:
02/08/2000
Application #:
09271214
Filing Dt:
03/17/1999
Title:
STACKED MULTIPLE-CHIP MODULE MICRO BALL GRID ARRAY PACKAGING
3
Patent #:
Issue Dt:
10/24/2000
Application #:
09318943
Filing Dt:
05/26/1999
Title:
HYBRID ASIC/MEMORY MODULE PACKAGE
4
Patent #:
Issue Dt:
03/18/2003
Application #:
09873420
Filing Dt:
06/05/2001
Publication #:
Pub Dt:
12/05/2002
Title:
SEMICONDUCTOR WAFER DESIGNED TO AVOID PROBED MARKS WHILE TESTING
5
Patent #:
Issue Dt:
05/28/2002
Application #:
09873421
Filing Dt:
06/05/2001
Title:
MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICES
6
Patent #:
Issue Dt:
08/12/2003
Application #:
09994700
Filing Dt:
11/28/2001
Publication #:
Pub Dt:
05/29/2003
Title:
WAFER LEVEL PACKAGING FOR MAKING FLIP-CHIPS
Assignor
1
Exec Dt:
05/30/2004
Assignee
1
CANON'S COURT, 22 VICTORIA STREET
HAMILTON HM 12, BERMUDA
Correspondence name and address
TROXELL LAW OFFICE PLLC
BRUCE H. TROXELL
5205 LEESBURG PIKE, SUITE 1404
FALLS CHURCH, VA 22041

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