Patent Assignment Details
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Reel/Frame: | 049120/0056 | |
| Pages: | 3 |
| | Recorded: | 05/08/2019 | | |
Attorney Dkt #: | AB6335-US | ALTR:0441 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/15/2021
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Application #:
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16368688
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Filing Dt:
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03/28/2019
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Publication #:
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Pub Dt:
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07/25/2019
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Title:
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NETWORK-ON-CHIP FOR INTER-DIE AND INTRA-DIE COMMUNICATION IN MODULARIZED INTEGRATED CIRCUIT DEVICES
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Assignee
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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INTEL CORPORATION C/O FLETCHER YODER PC
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P.O.BOX 692289
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HOUSTON, TX 77269-2289
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05/23/2024 02:21 PM
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