Patent Assignment Details
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| Reel/Frame: | 017801/0058 | |
| Pages: | 2 |
| | Recorded: | 04/21/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/22/2009
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Application #:
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11409297
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Filing Dt:
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04/21/2006
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Publication #:
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Pub Dt:
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09/06/2007
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Title:
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BOND PAD STRUCTURE FOR WIRE BONDING
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN ROC, 300-77 |
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Correspondence name and address
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STEVEN H. SLATER
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SLATER & MATSIL, L.L.P.
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17950 PRESTON RD.
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SUITE 1000
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DALLAS, TEXAS 75252-5793
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