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Reel/Frame:053021/0059   Pages: 4
Recorded: 06/24/2020
Attorney Dkt #:251640-9010
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 6
1
Patent #:
Issue Dt:
10/31/2017
Application #:
15206485
Filing Dt:
07/11/2016
Publication #:
Pub Dt:
01/19/2017
Title:
Substrate Structure and Manufacturing Method Thereof
2
Patent #:
Issue Dt:
04/10/2018
Application #:
15390892
Filing Dt:
12/27/2016
Publication #:
Pub Dt:
03/22/2018
Title:
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
3
Patent #:
Issue Dt:
04/23/2019
Application #:
15837042
Filing Dt:
12/11/2017
Publication #:
Pub Dt:
04/04/2019
Title:
Sensor Package and Method of Manufacturing the Same
4
Patent #:
Issue Dt:
01/11/2022
Application #:
16537694
Filing Dt:
08/12/2019
Publication #:
Pub Dt:
03/05/2020
Title:
PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
5
Patent #:
Issue Dt:
07/07/2020
Application #:
16548919
Filing Dt:
08/23/2019
Publication #:
Pub Dt:
03/05/2020
Title:
INTEGRATED DRIVING MODULE WITH ENERGY CONVERSION FUNCTION AND MANUFACTURING METHOD THEREOF
6
Patent #:
Issue Dt:
11/08/2022
Application #:
16878682
Filing Dt:
05/20/2020
Publication #:
Pub Dt:
09/03/2020
Title:
A MANUFACTURING METHOD OF AN INTEGRATED DRIVING MODULE WITH ENERGY CONVERSION FUNCTION
Assignor
1
Exec Dt:
06/22/2020
Assignee
1
NO.458-17, XINXING RD., HUKOU TOWNSHIP
HSINCHU COUNTY, TAIWAN 30353
Correspondence name and address
MCCLURE, QUALEY & RODACK, LLP
280 INTERSTATE NORTH CIRCLE
SUITE 550
ATLANTA, GA 30339

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