Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027652/0062 | |
| Pages: | 3 |
| | Recorded: | 02/03/2012 | | |
| Attorney Dkt #: | 2515.0371 CIP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/03/2013
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Application #:
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13366008
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Filing Dt:
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02/03/2012
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Publication #:
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Pub Dt:
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05/23/2013
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Title:
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Semiconductor Device and Method of Forming Reconstituted Wafer with Larger Carrier to Achieve More EWLB Packages per Wafer with Encapsulant Deposited Under Temperature and Pressure
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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PATENT LAW GROUP
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605 W. KNOX ROAD
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SUITE 104
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TEMPE, AZ 85284
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