Patent Assignment Details
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| Reel/Frame: | 047001/0062 | |
| Pages: | 4 |
| | Recorded: | 09/28/2018 | | |
| Attorney Dkt #: | 78924-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/24/2024
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Application #:
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16035696
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Filing Dt:
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07/15/2018
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Publication #:
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Pub Dt:
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01/16/2020
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Title:
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PACKAGE STRUCTURE WITH CONDUCTIVE PATTERNS IN A REDISTRIBUTION LAYER
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Assignee
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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JCIPRNET
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P.O. BOX 600 TAIPEI GUTING
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TAIPEI CITY, 10099 TAIWAN
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11/10/2024 01:02 PM
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