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Patent Assignment Details
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Reel/Frame:042304/0064   Pages: 6
Recorded: 04/21/2017
Conveyance: CHANGE OF ADDRESS
Total properties: 3
1
Patent #:
Issue Dt:
06/26/2012
Application #:
12312928
Filing Dt:
06/01/2009
Publication #:
Pub Dt:
02/04/2010
Title:
PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION AND FLEXIBLE PRINTED CIRCUIT BOARD
2
Patent #:
Issue Dt:
07/08/2014
Application #:
13048397
Filing Dt:
03/15/2011
Publication #:
Pub Dt:
10/27/2011
Title:
METHOD FOR FORMING AN ADHESIVE LAYER AND ADHESIVE COMPOSITION
3
Patent #:
Issue Dt:
01/14/2014
Application #:
13091682
Filing Dt:
04/21/2011
Publication #:
Pub Dt:
10/27/2011
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Assignor
1
Exec Dt:
03/09/2015
Assignee
1
32-42 HIGASHI SHINAGAWA 3 CHO-ME, SHINAGAWA-KU,
TOKYO, JAPAN 140-8860
Correspondence name and address
CPA GLOBAL LTD
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY

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