Patent Assignment Details
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Reel/Frame: | 017817/0068 | |
| Pages: | 2 |
| | Recorded: | 04/25/2006 | | |
Attorney Dkt #: | 56425(71987) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/21/2009
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Application #:
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11411740
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Filing Dt:
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04/25/2006
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Publication #:
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Pub Dt:
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05/03/2007
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Title:
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SEMICONDUCTOR PACKAGE AND SUBSTRATE STRUCTURE THEREOF
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Assignee
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NO. 123, SEC. 3, DA FONG ROAD |
TANTZU |
TAICHUNG, TAIWAN ROC |
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Correspondence name and address
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PETER F. CORLESS
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EDWARD ANGELLE PALMER & DODGE LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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