Patent Assignment Details
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| Reel/Frame: | 017943/0068 | |
| Pages: | 4 |
| | Recorded: | 05/31/2006 | | |
| Attorney Dkt #: | 125255-06032572 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11367708
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Filing Dt:
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03/06/2006
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Publication #:
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Pub Dt:
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10/05/2006
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Title:
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Method of manufacturing enhanced thermal dissipation integrated circuit package
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Assignee
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| QPL INDUSTRIAL BUILDING, 138 TEXACO ROAD |
| TSUEN WAN, NEW TERRITORIES, HONG KONG |
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Correspondence name and address
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MAYER, BROWN, ROWE & MAW LLP
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1909 K STREET, N.W.
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WASHINGTON, DC 20006
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