Patent Assignment Details
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| Reel/Frame: | 036454/0071 | |
| Pages: | 3 |
| | Recorded: | 08/30/2015 | | |
| Attorney Dkt #: | TF15IPC006 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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12007361
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Filing Dt:
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01/09/2008
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Publication #:
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Pub Dt:
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08/07/2008
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Title:
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PACKAGE STRUCTURE AND METHOD FOR CHIP WITH TWO ARRAYS OF BONDING PADS ON BGA SUBSTRATE FOR PREVENTING GOLD BONDING WIRES FROM COLLAPSE
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Assignee
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| 3F, NO. 2,TECHNOLOGY RD., V, SCIENCE-BASED INDUSTRIAL PARK, |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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CHIH FENG YEH
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188 OLD CASTLE POINT RD.,
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WAPPINGERS FALLS, NY 12590
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