Patent Assignment Details
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| Reel/Frame: | 058193/0071 | |
| Pages: | 2 |
| | Recorded: | 11/23/2021 | | |
| Attorney Dkt #: | 7017.349 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/20/2023
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Application #:
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17533234
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Filing Dt:
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11/23/2021
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Publication #:
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Pub Dt:
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12/01/2022
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Title:
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HEAT ASSISTED FLIP CHIP BONDING APPARATUS
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Assignee
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| NO. 1, SHUEFU ROAD, NEIPU TOWNSHIP |
| PINGTUNG COUNTY, TAIWAN |
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Correspondence name and address
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JACKSON INTELLECTUAL PROPERTY GROUP PLLC
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106 STARVALE LANE
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SHIPMAN, VA 22971
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05/27/2024 05:31 AM
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