Patent Assignment Details
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Reel/Frame: | 064758/0071 | |
| Pages: | 7 |
| | Recorded: | 08/30/2023 | | |
Attorney Dkt #: | GAOWO-204US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18457904
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Filing Dt:
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08/29/2023
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Publication #:
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Pub Dt:
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05/02/2024
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Title:
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INTERFACE INTERCONNECT STRUCTURE FOR EFFICIENT HEAT DISSIPATION OF POWER ELECTRONIC DEVICE AND PREPARATION METHOD THEREFOR
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Assignee
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NO.2, LINGGONG ROAD, HIGH-TECH PARK |
LIAONING PROVINCE |
DALIAN, CHINA 116024 |
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Correspondence name and address
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WOOD HERRON & EVANS LLP
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600 VINE STREET
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SUITE 2800
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CINCINNATI, OH 45202
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05/24/2024 10:22 AM
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