Patent Assignment Details
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| Reel/Frame: | 040772/0073 | |
| Pages: | 5 |
| | Recorded: | 11/30/2016 | | |
| Attorney Dkt #: | 15-02696 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/27/2018
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Application #:
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15365192
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Filing Dt:
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11/30/2016
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Publication #:
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Pub Dt:
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06/29/2017
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Title:
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SEMICONDUCTOR MOUNTING APPARATUS, HEAD THEREOF, AND METHOD FOR MANUFACTURING LAMINATED CHIP
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Assignee
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
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Correspondence name and address
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FUJITSU PATENT CENTER
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2318 MILL ROAD
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ALEXANDRIA, VA 22314
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