Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060094/0073 | |
| Pages: | 3 |
| | Recorded: | 06/03/2022 | | |
| Attorney Dkt #: | 2519-0557PUS2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/14/2024
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Application #:
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17829950
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Filing Dt:
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06/01/2022
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Publication #:
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Pub Dt:
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09/15/2022
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Title:
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Method for Manufacturing an Interconnection Structure having a Bottom Via Spacer
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD
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SUITE 100E
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FALLS CHURCH, VA 22042
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05/25/2024 11:41 PM
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