Patent Assignment Details
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| Reel/Frame: | 017299/0075 | |
| Pages: | 11 |
| | Recorded: | 03/13/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11180459
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Filing Dt:
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07/12/2005
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Publication #:
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Pub Dt:
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01/18/2007
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Title:
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Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages
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Assignee
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| 101 COLUMBIA ROAD |
| PO BOX 2245 |
| MORRISTOWN, NEW JERSEY 07962 |
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Correspondence name and address
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SANDRA P. THOMPSON
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18400 VON KARMAN, SUITE 800
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BUCHALTER NEMER
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IRVINE, CA 92612
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