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Reel/Frame:057032/0075   Pages: 7
Recorded: 07/30/2021
Attorney Dkt #:A264396
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/23/2024
Application #:
17389622
Filing Dt:
07/30/2021
Publication #:
Pub Dt:
12/01/2022
Title:
THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR ARCHITECTURE AND METHOD OF MANUFACTURING THE SAME
Assignors
1
Exec Dt:
07/29/2021
2
Exec Dt:
07/29/2021
3
Exec Dt:
07/29/2021
4
Exec Dt:
07/29/2021
5
Exec Dt:
07/29/2021
Assignee
1
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF 16677
Correspondence name and address
SUGHRUE MION, PLLC.
2000 PENNSYLVANIA AVENUE, N.W.
9TH FLOOR
WASHINGTON, DC 20006

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