Patent Assignment Details
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| Reel/Frame: | 038129/0077 | |
| Pages: | 4 |
| | Recorded: | 03/30/2016 | | |
| Attorney Dkt #: | A016.029.NPRUS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/11/2017
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Application #:
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15084442
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Filing Dt:
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03/29/2016
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Title:
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THREE DIMENSIONAL FULLY MOLDED POWER ELECTRONICS MODULE HAVING A PLURALITY OF SPACERS FOR HIGH POWER APPLICATIONS
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Assignee
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| 5/F, PHOTONICS CENTRE, 2 SCIENCE PARK EAST AVENUE |
| HONG KONG SCIENCE PARK, SHATIN, NEW TERRITORIES |
| HONG KONG, CHINA |
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Correspondence name and address
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EAGLE IP LIMITED
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ROOM 508-509, GLOBAL GATEWAY TOWER
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63 WING HONG STREET, LAI CHI KOK
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KOWLOON, CHINA
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05/29/2024 06:49 PM
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