Patent Assignment Details
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| Reel/Frame: | 015938/0078 | |
| Pages: | 3 |
| | Recorded: | 10/26/2004 | | |
| Attorney Dkt #: | CU-3961 RJS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/06/2005
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Application #:
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10973169
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Filing Dt:
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10/26/2004
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Title:
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SEMICONDUCTOR PACKAGE WITH IMPROVED THERMAL EMISSION PROPERTY
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Assignee
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| SAN 136-1, AMI-RI |
| BUBAL-EUB, ICH'ON, KYOUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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C/O LADAS & PARRY LLP
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RICHARD J. STREIT
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224 SOUTH MICHIGAN AVENUE
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CHICAGO, IL 60604
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