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Reel/Frame:058070/0079   Pages: 3
Recorded: 11/10/2021
Attorney Dkt #:17908-283
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/06/2023
Application #:
17523093
Filing Dt:
11/10/2021
Publication #:
Pub Dt:
03/30/2023
Title:
PACKAGE STRUCTURE WITH INTERCONNECTION BETWEEN CHIPS AND PACKAGING METHOD THEREOF
Assignors
1
Exec Dt:
10/27/2021
2
Exec Dt:
10/27/2021
3
Exec Dt:
10/27/2021
Assignee
1
NO.179, SHANYING ROAD, GUISHAN DISTRICT
TAOYUAN CITY, TAIWAN
Correspondence name and address
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
8230 BOONE BLVD, SUITE 405
VIENNA, VA 22182

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