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Patent #:
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Issue Dt:
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08/15/2000
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Application #:
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09201928
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Filing Dt:
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12/01/1998
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Title:
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REVERSE LINEAR POLISHER WITH LOADABLE HOUSING
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Patent #:
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Issue Dt:
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01/23/2001
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Application #:
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09201929
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Filing Dt:
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12/01/1998
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Title:
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METHOD AND APPARATUS FOR ELECTRO-CHEMICAL MECHANICAL DEPOSITION
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Patent #:
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Issue Dt:
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06/26/2001
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Application #:
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09283024
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Filing Dt:
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03/30/1999
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Title:
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APPARATUS FOR FORMING AN ELECTRICAL CONTACT WITH A SEMICONDCTOR SUBSTRATE
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Patent #:
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Issue Dt:
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12/11/2001
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Application #:
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09285621
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Filing Dt:
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04/03/1999
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Title:
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METHOD AND APPARATUS FOR PLATING AND POLISHING A SEMICONDUCTOR SUBSTRATE
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Patent #:
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Issue Dt:
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02/17/2004
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Application #:
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09351868
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Filing Dt:
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07/12/1999
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Title:
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METHOD AND APPARATUS FOR SIMULTANEOUSLY CLEANING AND ANNEALING A WORKPIECE
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Patent #:
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Issue Dt:
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06/25/2002
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Application #:
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09373681
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Filing Dt:
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08/13/1999
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Title:
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METHOD AND APPARATUS FOR DEPOSITING AND CONTROLLING THE TEXTURE OF A THIN FILM
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Patent #:
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Issue Dt:
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03/12/2002
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Application #:
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09398258
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Filing Dt:
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09/17/1999
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Title:
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NOVEL CHIP INTERCONNECT AND PACKAGING DEPOSITION METHODS AND STRUCTURES
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Patent #:
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Issue Dt:
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03/05/2002
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Application #:
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09466014
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Filing Dt:
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12/17/1999
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Title:
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VERTICALLY CONFIGURED CHAMBER USED FOR MULTIPLE PROCESSES
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Patent #:
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Issue Dt:
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09/02/2003
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Application #:
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09472523
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Filing Dt:
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12/27/1999
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Title:
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WORK PIECE CARRIER HEAD FOR PLATING AND POLISHING
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Patent #:
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Issue Dt:
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10/07/2003
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Application #:
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09483095
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Filing Dt:
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01/14/2000
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Title:
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WORKPIECE PROXIMITY PLATING APPARATUS
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Patent #:
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Issue Dt:
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07/02/2002
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Application #:
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09511278
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Filing Dt:
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02/23/2000
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Title:
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PAD DESIGNS AND STRUCTURES FOR A VERSATILE MATERIALS PROCESSING APPARATUS
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Patent #:
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Issue Dt:
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06/24/2003
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Application #:
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09534704
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Filing Dt:
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03/24/2000
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Title:
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METHODS FOR REPAIRING DEFECTS ON A SEMICONDUCTOR SUBSTRATE
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Patent #:
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Issue Dt:
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03/12/2002
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Application #:
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09544558
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Filing Dt:
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04/06/2000
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Title:
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MODIFIED PLATING SOLUTION FOR PLATING AND PLANARIZATION AND PROCESS UTILIZING SAME
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Patent #:
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Issue Dt:
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11/12/2002
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Application #:
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09568584
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Filing Dt:
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05/11/2000
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Title:
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ANODE ASSEMBLY FOR PLATING AND PLANARIZING A CONDUCTIVE LAYER
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Patent #:
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Issue Dt:
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03/27/2001
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Application #:
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09576064
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Filing Dt:
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05/22/2000
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Title:
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Reverse linear polisher with loadable housing
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Patent #:
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Issue Dt:
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01/13/2004
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Application #:
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09607567
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Filing Dt:
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06/29/2000
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Title:
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METHOD AND APPARATUS FOR ELECTRO CHEMICAL MECHANICAL DEPOSITION
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Patent #:
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Issue Dt:
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07/02/2002
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Application #:
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09621969
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Filing Dt:
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07/21/2000
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Title:
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METHOD AND APPARATUS EMPLOYING PAD DESIGNS AND STRUCTURES WITH IMPROVED FLUID DISTRIBUTION
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Patent #:
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Issue Dt:
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10/22/2002
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Application #:
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09684059
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Filing Dt:
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10/06/2000
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Title:
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POLISHING APPARATUS AND METHOD WITH A REFRESHING POLISHING BELT AND LOADABLE HOUSING
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Patent #:
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Issue Dt:
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12/24/2002
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Application #:
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09685934
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Filing Dt:
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10/11/2000
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Title:
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DEVICE PROVIDING ELECTRICAL CONTACT TO THE SURFACE OF A SEMICONDUCTOR WORKPIECE DURING METAL PLATING
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Patent #:
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Issue Dt:
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11/19/2002
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Application #:
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09735546
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Filing Dt:
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12/14/2000
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Publication #:
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Pub Dt:
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11/01/2001
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Title:
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METHOD OF AND APPARATUS FOR MAKING ELECTRICAL CONTACT TO WAFER SURFACE FOR FULL-FACE ELECTROPLATING OR ELECTROPOLISHING
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Patent #:
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Issue Dt:
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06/11/2002
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Application #:
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09738561
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Filing Dt:
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12/14/2000
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Publication #:
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Pub Dt:
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11/22/2001
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Title:
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METHOD AND APPARATUS FOR ELECTROPLATING AND ELECTROPOLISHING
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Patent #:
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Issue Dt:
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03/18/2003
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Application #:
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09740701
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Filing Dt:
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12/18/2000
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Publication #:
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Pub Dt:
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06/20/2002
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Title:
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PLATING METHOD AND APPARATUS THAT CREATES A DIFFERENTIAL BETWEEN ADDITIVE DISPOSED ON A TOP SURFACE AND A CAVITY SURFACE OF A WORKPIECE USING AN EXTERNAL INFLUENCE
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Patent #:
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Issue Dt:
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08/26/2003
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Application #:
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09760757
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Filing Dt:
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01/17/2001
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Publication #:
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Pub Dt:
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05/09/2002
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Title:
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METHOD AND APPARATUS FOR ELECTRODEPOSITION OF UNIFORM FILM WITH MINIMAL EDGE EXCLUSION ON SUBSTRATE
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Patent #:
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Issue Dt:
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10/11/2005
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Application #:
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09795687
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Filing Dt:
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02/27/2001
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Publication #:
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Pub Dt:
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07/11/2002
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Title:
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INTEGRATED SYSTEM FOR PROCESSING SEMICONDUCTOR WAFERS
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Patent #:
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Issue Dt:
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02/08/2005
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Application #:
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09841622
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Filing Dt:
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04/23/2001
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Publication #:
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Pub Dt:
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10/24/2002
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Title:
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ELECTROETCHING PROCESS AND SYSTEM
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Patent #:
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Issue Dt:
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02/24/2004
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Application #:
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09845262
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Filing Dt:
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05/01/2001
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Publication #:
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Pub Dt:
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11/07/2002
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Title:
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ANODE DESIGNS FOR PLANAR METAL DEPOSITS WITH ENHANCED ELECTROLYTE SOLUTION BLENDING AND PROCESS OF SUPPLYING ELECTROLYTE SOLUTION USING SUCH DESIGNS
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Patent #:
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Issue Dt:
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10/12/2004
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Application #:
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09855059
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Filing Dt:
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05/15/2001
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Publication #:
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Pub Dt:
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06/27/2002
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Title:
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APPARATUS FOR CONTROLLING THICKNESS UNIFORMITY OF ELECTROPLATED AND ELECTROETCHED LAYERS
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Patent #:
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Issue Dt:
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10/29/2002
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Application #:
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09877335
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Filing Dt:
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06/07/2001
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Publication #:
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Pub Dt:
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03/14/2002
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Title:
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METHOD FOR FORMING AN ELECTRICAL CONTACT WITH A SEMICONDUCTOR SUBSTRATE
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Patent #:
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Issue Dt:
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10/15/2002
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Application #:
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09880730
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Filing Dt:
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06/12/2001
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Publication #:
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Pub Dt:
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01/24/2002
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Title:
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POLISHING APPARATUS AND METHOD WITH BELT DRIVE SYSTEM ADAPTED TO EXTEND THE LIFETIME OF A REFRESHING POLISHING BELT PROVIDED THEREIN
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Patent #:
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Issue Dt:
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06/14/2005
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Application #:
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09905335
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Filing Dt:
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07/13/2001
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Publication #:
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Pub Dt:
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03/21/2002
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Title:
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PACKAGING DEPOSITION METHODS
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Patent #:
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Issue Dt:
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02/15/2005
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Application #:
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09910686
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07/20/2001
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Publication #:
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Pub Dt:
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09/12/2002
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Title:
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METHOD OF SEALING WAFER BACKSIDE FOR FULL-FACE ELECTROCHEMICAL PLATING
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Patent #:
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Issue Dt:
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02/22/2005
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Application #:
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09919788
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Filing Dt:
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07/31/2001
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Publication #:
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Pub Dt:
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02/21/2002
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Title:
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PLATING METHOD AND APPARATUS THAT CREATES A DIFFERENTIAL BETWEEN ADDITIVE DISPOSED ON A TOP SURFACE AND A CAVITY SURFACE OF A WORKPIECE USING AN INDIRECT EXTERNAL INFLUENCE
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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09941360
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Filing Dt:
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08/28/2001
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Publication #:
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Pub Dt:
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01/31/2002
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Title:
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APPARATUS FOR PLATING AND POLISHING A SEMICONDUCTOR WORKPIECE
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Patent #:
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Issue Dt:
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07/26/2005
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Application #:
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09961193
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09/20/2001
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Publication #:
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Pub Dt:
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07/01/2004
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Title:
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PLATING METHOD AND APPARATUS FOR CONTROLLING DEPOSITION ON PREDETERMINED PORTIONS OF A WORKPIECE
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11/18/2003
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09969531
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10/01/2001
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Pub Dt:
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06/06/2002
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Title:
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METHOD AND SYSTEM TO PROVIDE MATERIAL REMOVAL AND PLANARIZATION EMPLOYING A REACTIVE PAD
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06/17/2003
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09976469
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10/12/2001
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Pub Dt:
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04/17/2003
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Title:
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CHEMICAL MECHANICAL POLISHING ENDPOINT DETECTION
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Issue Dt:
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12/23/2003
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09976972
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10/11/2001
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Pub Dt:
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02/21/2002
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Title:
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SEMICONDUCTOR WORKPIECE PROXIMITY PLATING METHODS AND APPARATUS
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08/23/2005
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09982558
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10/17/2001
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10/03/2002
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Title:
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METHOD AND APPARATUS FOR AVOIDING PARTICLE ACCUMULATION IN ELECTRODEPOSITION
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08/30/2005
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10017494
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12/07/2001
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Pub Dt:
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09/26/2002
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Title:
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PLANARITY DETECTION METHODS AND APPARATUS FOR ELECTROCHEMICAL MECHANICAL PROCESSING SYSTEMS
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08/24/2004
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10032219
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12/21/2001
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Pub Dt:
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07/24/2003
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Title:
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METHOD AND SYSTEM TO PROVIDE ELECTROPLANARIZATION OF A WORKPIECE WITH A CONDUCTING MATERIAL LAYER
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12/21/2004
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10032318
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12/21/2001
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Pub Dt:
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06/26/2003
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Title:
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ELECTROCHEMICAL EDGE AND BEVEL CLEANING PROCESS AND SYSTEM
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11/29/2005
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10041029
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12/28/2001
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09/05/2002
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Title:
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METHOD OF USING VERTICALLY CONFIGURED CHAMBER USED FOR MULTIPLE PROCESSES
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04/26/2005
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10041058
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12/28/2001
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Publication #:
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Pub Dt:
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05/16/2002
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Title:
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VERTICALLY CONFIGURED CHAMBER USED FOR MULTIPLE PROCESSES
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04/06/2004
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10043656
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01/08/2002
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Pub Dt:
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10/17/2002
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Title:
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CARRIER HEAD FOR HOLDING A WAFER AND ALLOWING PROCESSING ON A FRONT FACE THEREOF TO OCCUR
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08/17/2004
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10051755
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01/15/2002
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10/24/2002
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Title:
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EDGE AND BEVEL CLEANING PROCESS AND SYSTEM
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06/21/2005
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10052475
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01/17/2002
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11/21/2002
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Title:
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CHEMICAL MECHANICAL POLISHING ENDPOINT DETECTION
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10/25/2005
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10093185
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03/05/2002
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07/11/2002
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Title:
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METHOD AND APPARATUS FOR FORMING AN ELECTRICAL CONTACT WITH A SEMICONDUCTOR SUBSTRATE
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08/09/2005
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10105016
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03/22/2002
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09/25/2003
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Title:
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CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS USING A FLEXIBLE PAD AND VARIABLE FLUID FLOW FOR VARIABLE POLISHING
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11/23/2004
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10117991
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04/05/2002
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09/25/2003
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ELECTROETCHING METHODS AND SYSTEMS USING CHEMICAL AND MECHANICAL INFLUENCE
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11/22/2005
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10122646
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04/12/2002
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10/16/2003
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Title:
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Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
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07/08/2003
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10126464
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04/18/2002
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01/30/2003
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Title:
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PAD TENSIONING METHOD AND SYSTEM IN A BI-DIRECTIONAL LINEAR POLISHER
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10/21/2003
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10126469
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04/18/2002
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01/30/2003
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Title:
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SINGLE DRIVE SYSTEM FOR A BI-DIRECTIONAL LINEAR CHEMICAL MECHANICAL POLISHING APPARATUS
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05/27/2008
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10152793
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05/23/2002
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Pub Dt:
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09/19/2002
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PAD DESIGNS AND STRUCTURES FOR A VERSATILE MATERIALS PROCESSING APPARATUS
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07/03/2007
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10155828
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05/23/2002
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04/03/2003
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LOW-FORCE ELECTROCHEMICAL MECHANICAL PROCESSING METHOD AND APPARATUS
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09/06/2005
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10159295
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05/31/2002
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01/09/2003
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METHOD AND APPARATUS OF SEALING WAFER BACKSIDE FOR FULL-FACE ELECTROCHEMICAL PLATING
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01/04/2005
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10165673
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06/06/2002
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10/24/2002
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METHOD AND APPARATUS FOR DEPOSITING AND CONTROLLING THE TEXTURE OF A THIN FILM
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04/20/2004
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10197090
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07/15/2002
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08/14/2003
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Title:
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ADVANCED CHEMICAL MECHANICAL POLISHING SYSTEM WITH SMART ENDPOINT DETECTION
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|
|
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Patent #:
|
|
Issue Dt:
|
05/18/2004
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Application #:
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10199924
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Filing Dt:
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07/19/2002
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Publication #:
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Pub Dt:
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08/21/2003
| | | | |
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Title:
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DISTRIBUTED CONTROL SYSTEM FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
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Patent #:
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|
Issue Dt:
|
09/20/2005
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Application #:
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10201604
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Filing Dt:
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07/22/2002
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Publication #:
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Pub Dt:
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02/27/2003
| | | | |
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Title:
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MULTI STEP ELECTRODEPOSITION PROCESS FOR REDUCING DEFECTS AND MINIMIZING FILM THICKNESS
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Patent #:
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Issue Dt:
|
03/15/2005
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Application #:
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10201606
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Filing Dt:
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07/22/2002
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Publication #:
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Pub Dt:
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06/26/2003
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Title:
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METHOD FOR ELECTROCHEMICALLY PROCESSING A WORKPIECE
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Patent #:
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Issue Dt:
|
06/07/2005
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Application #:
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10238665
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Filing Dt:
|
09/09/2002
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Publication #:
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Pub Dt:
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01/09/2003
| | | | |
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Title:
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METHOD AND APPARATUS FOR ELECTRO-CHEMICAL MECHANICAL DEPOSITION
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|
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Patent #:
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Issue Dt:
|
08/10/2004
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Application #:
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10251377
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Filing Dt:
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09/20/2002
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Publication #:
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Pub Dt:
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01/23/2003
| | | | |
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Title:
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ANODE ASSEMBLY FOR PLATING AND PLANARIZING A CONDUCTIVE LAYER
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Patent #:
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Issue Dt:
|
08/12/2003
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Application #:
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10252149
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Filing Dt:
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09/20/2002
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Publication #:
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Pub Dt:
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01/30/2003
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Title:
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POLISHING APPARATUS AND METHOD WITH BELT DRIVE SYSTEM ADAPTED TO EXTEND THE LIFETIME OF A REFRESHING POLISHING BELT PROVIDED THEREIN
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Patent #:
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Issue Dt:
|
02/06/2007
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Application #:
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10264726
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Filing Dt:
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10/03/2002
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Publication #:
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Pub Dt:
|
02/13/2003
| | | | |
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Title:
|
FABRICATION OF SEMICONDUCTOR INTERCONNECT STRUCTURES
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Patent #:
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Issue Dt:
|
02/08/2005
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Application #:
|
10265460
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Filing Dt:
|
10/03/2002
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Publication #:
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Pub Dt:
|
02/13/2003
| | | | |
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Title:
|
METHOD AND APPARATUS FOR FULL SURFACE ELECTROTREATING OF A WAFER
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|
|
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Patent #:
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Issue Dt:
|
05/01/2007
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Application #:
|
10282930
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Filing Dt:
|
10/28/2002
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Publication #:
|
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Pub Dt:
|
05/15/2003
| | | | |
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Title:
|
METHOD AND SYSTEM TO PROVIDE ELECTRICAL CONTACTS FOR ELECTROTREATING PROCESSES
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|
|
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Patent #:
|
|
Issue Dt:
|
11/09/2004
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Application #:
|
10282976
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Filing Dt:
|
10/28/2002
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Publication #:
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Pub Dt:
|
05/01/2003
| | | | |
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Title:
|
METHOD AND STRUCTURE FOR THRU-MASK CONTACT ELECTRODEPOSITION
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|
|
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Patent #:
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|
Issue Dt:
|
05/01/2007
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Application #:
|
10283025
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Filing Dt:
|
10/28/2002
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Publication #:
|
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Pub Dt:
|
05/15/2003
| | | | |
|
Title:
|
METHOD AND SYSTEM TO PROVIDE ELECTRICAL CONTACTS FOR ELECTROTREATING PROCESSES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2006
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Application #:
|
10288558
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Filing Dt:
|
11/04/2002
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Publication #:
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Pub Dt:
|
06/12/2003
| | | | |
|
Title:
|
ELECTROCHEMICAL MECHANICAL PROCESSING WITH ADVANCIBLE SWEEPER
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|
|
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Patent #:
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|
Issue Dt:
|
03/11/2008
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Application #:
|
10292750
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Filing Dt:
|
11/12/2002
|
|
Publication #:
|
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Pub Dt:
|
05/22/2003
| | | | |
|
Title:
|
APPARATUS FOR ELECTROPROCESSING A WORKPIECE SURFACE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/24/2009
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Application #:
|
10292911
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Filing Dt:
|
11/13/2002
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|
Publication #:
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Pub Dt:
|
07/10/2003
| | | | |
|
Title:
|
EXTENSIBLE EXAM LANGUAGE (XXL) PROTOCOL FOR COMPUTER BASED TESTING
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Patent #:
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|
Issue Dt:
|
08/23/2005
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Application #:
|
10295197
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Filing Dt:
|
11/15/2002
|
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Publication #:
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Pub Dt:
|
05/22/2003
| | | | |
|
Title:
|
APPARTUS AND METHOD FOR LOADING A WAFER IN POLISHING SYSTEM
|
|
|
|
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Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10302213
|
Filing Dt:
|
11/22/2002
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|
Publication #:
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Pub Dt:
|
04/17/2003
| | | | |
|
Title:
|
Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact
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|
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Patent #:
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|
Issue Dt:
|
09/13/2005
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Application #:
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10321150
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Filing Dt:
|
12/17/2002
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Publication #:
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Pub Dt:
|
08/14/2003
| | | | |
|
Title:
|
In-situ endpoint detection for non-transparent polishing member
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|
|
|
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Patent #:
|
|
Issue Dt:
|
04/18/2006
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Application #:
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10327609
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Filing Dt:
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12/20/2002
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|
Publication #:
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Pub Dt:
|
07/31/2003
| | | | |
|
Title:
|
ELECTROCHEMICAL EDGE AND BEVEL CLEANING PROCESS AND SYSTEM
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/22/2005
|
Application #:
|
10346425
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Filing Dt:
|
01/17/2003
|
|
Publication #:
|
|
Pub Dt:
|
02/05/2004
| | | | |
|
Title:
|
ADVANCED CHEMICAL MECHANICAL POLISHING SYSTEM WITH SMART ENDPOINT DETECTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2005
|
Application #:
|
10358565
|
Filing Dt:
|
02/04/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/28/2003
| | | | |
|
Title:
|
METHOD AND STRUCTURE TO REDUCE DEFECTS IN INTEGRATED CIRCUITS AND SUBSTRATES
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|
Patent #:
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|
Issue Dt:
|
07/15/2008
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Application #:
|
10367111
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Filing Dt:
|
02/14/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/27/2003
| | | | |
|
Title:
|
LONG-LIFE WORKPIECE SURFACE INFLUENCING DEVICE STRUCTURE AND MANUFACTURING METHOD
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Patent #:
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Issue Dt:
|
06/13/2006
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Application #:
|
10369118
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Filing Dt:
|
02/18/2003
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Publication #:
|
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Pub Dt:
|
09/04/2003
| | | | |
|
Title:
|
INTEGRATED SYSTEM FOR PROCESSING SEMICONDUCTOR WAFERS
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Patent #:
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Issue Dt:
|
09/13/2005
|
Application #:
|
10379265
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Filing Dt:
|
03/03/2003
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Publication #:
|
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Pub Dt:
|
01/22/2004
| | | | |
|
Title:
|
DEFECT-FREE THIN AND PLANAR FILM PROCESSING
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|
Patent #:
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|
Issue Dt:
|
09/05/2006
|
Application #:
|
10383466
|
Filing Dt:
|
03/06/2003
|
|
Publication #:
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Pub Dt:
|
09/11/2003
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR PLANAR MATERIAL REMOVAL TECHNIQUE USING MULTI-PHASE PROCESS ENVIRONMENT
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Patent #:
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Issue Dt:
|
08/25/2009
|
Application #:
|
10391924
|
Filing Dt:
|
03/18/2003
|
|
Publication #:
|
|
Pub Dt:
|
05/01/2008
| | | | |
|
Title:
|
ELECTROPOLISHING SYSTEM AND PROCESS
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|
Patent #:
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|
Issue Dt:
|
12/12/2006
|
Application #:
|
10407892
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Filing Dt:
|
04/04/2003
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Publication #:
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Pub Dt:
|
09/04/2003
| | | | |
|
Title:
|
CHIP INTERCONNECT AND PACAGING DEPOSITION METHODS AND STRUCTURES
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Patent #:
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Issue Dt:
|
03/13/2007
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Application #:
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10425782
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Filing Dt:
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04/29/2003
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Publication #:
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Pub Dt:
|
10/07/2004
| | | | |
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Title:
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METHOD FOR REDUCTION OF DEFECTS IN WET PROCESSED LAYERS
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Patent #:
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Issue Dt:
|
03/15/2005
|
Application #:
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10427309
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Filing Dt:
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04/30/2003
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Publication #:
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|
Pub Dt:
|
12/18/2003
| | | | |
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Title:
|
METHOD AND SYSTEM MONITORING AND CONTROLLING FILM THICKNESS PROFILE DURING PLATING AND ELECTROETCHING
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Patent #:
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Issue Dt:
|
10/16/2007
|
Application #:
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10459320
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Filing Dt:
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06/10/2003
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Publication #:
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Pub Dt:
|
11/27/2003
| | | | |
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Title:
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DEVICE PROVIDING ELECTRICAL CONTACT TO THE SURFACE OF A SEMICONDUCTOR WORKPIECE DURING PROCESSING
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Patent #:
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Issue Dt:
|
12/18/2007
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Application #:
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10459321
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Filing Dt:
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06/10/2003
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Publication #:
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Pub Dt:
|
11/13/2003
| | | | |
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Title:
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DEVICE PROVIDING ELECTRICAL CONTACT TO THE SURFACE OF A SEMICONDUCTOR WORKPIECE DURING PROCESSING
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Patent #:
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Issue Dt:
|
02/12/2008
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Application #:
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10459323
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Filing Dt:
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06/10/2003
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Publication #:
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Pub Dt:
|
11/13/2003
| | | | |
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Title:
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DEVICE PROVIDING ELECTRICAL CONTACT TO THE SURFACE OF A SEMICONDUCTOR WORKPIECE DURING PROCESSING
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Patent #:
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Issue Dt:
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09/13/2005
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Application #:
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10460032
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Filing Dt:
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06/11/2003
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Publication #:
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Pub Dt:
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11/13/2003
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Title:
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METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE WITH MINIMAL EDGE EXCLUSION
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Patent #:
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Issue Dt:
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06/21/2005
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Application #:
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10614311
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Filing Dt:
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07/07/2003
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Publication #:
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Pub Dt:
|
05/20/2004
| | | | |
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Title:
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ADVANCED BI-DIRECTIONAL LINEAR POLISHING SYSTEM AND METHOD
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Patent #:
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Issue Dt:
|
09/06/2005
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Application #:
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10632481
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Filing Dt:
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08/01/2003
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Publication #:
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Pub Dt:
|
05/06/2004
| | | | |
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Title:
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FLUID BEARING SLIDE ASSEMBLY FOR WORKPIECE POLISHING
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10637243
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Filing Dt:
|
08/07/2003
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Publication #:
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Pub Dt:
|
02/10/2005
| | | | |
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Title:
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Reduction of defects in conductive layers during electroplating
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Patent #:
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Issue Dt:
|
07/31/2007
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Application #:
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10637731
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Filing Dt:
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08/08/2003
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Publication #:
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Pub Dt:
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02/10/2005
| | | | |
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Title:
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METHOD AND SYSTEM FOR OPTICALLY ENHANCED METAL PLANARIZATION
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Patent #:
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Issue Dt:
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07/31/2007
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Application #:
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10638751
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Filing Dt:
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08/11/2003
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Publication #:
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Pub Dt:
|
10/14/2004
| | | | |
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Title:
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METHOD AND APPARATUS FOR ELIMINATING DEFECTS AND IMPROVING UNIFORMITY IN ELECTROCHEMICALLY PROCESSED CONDUCTIVE LAYERS
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Patent #:
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Issue Dt:
|
01/08/2008
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Application #:
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10654542
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Filing Dt:
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09/02/2003
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Publication #:
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Pub Dt:
|
06/17/2004
| | | | |
|
Title:
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CONSTANT LOW FORCE WAFER CARRIER FOR ELECTROCHEMICAL MECHANICAL PROCESSING AND CHEMICAL MECHANICAL POLISHING
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Patent #:
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Issue Dt:
|
12/13/2005
|
Application #:
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10663318
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Filing Dt:
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09/16/2003
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Publication #:
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Pub Dt:
|
03/18/2004
| | | | |
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Title:
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CONDUCTIVE STRUCTURE FABRICATION PROCESS USING NOVEL LAYERED STRUCTURE AND CONDUCTIVE STRUCTURE FABRICATED THEREBY FOR USE IN MULTI-LEVEL METALLIZATION
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|
Patent #:
|
NONE
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Issue Dt:
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|
Application #:
|
10676895
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Filing Dt:
|
09/30/2003
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Publication #:
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Pub Dt:
|
07/22/2004
| | | | |
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Title:
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Edge and bevel cleaning process and system
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Patent #:
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Issue Dt:
|
05/16/2006
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Application #:
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10692952
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Filing Dt:
|
10/24/2003
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Publication #:
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Pub Dt:
|
09/23/2004
| | | | |
|
Title:
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PROCESS AND SYSTEM FOR ELIMINATING GAS BUBBLES DURING ELECTROCHEMICAL PROCESSING
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|
Patent #:
|
NONE
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Issue Dt:
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|
Application #:
|
10692953
|
Filing Dt:
|
10/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/23/2004
| | | | |
|
Title:
|
Process and apparatus for air bubble removal during electrochemical processing
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|
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
10698878
|
Filing Dt:
|
10/31/2003
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2005
| | | | |
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Title:
|
Methods for depositing high yield and low defect density conductive films in damascene structures
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|
